TY  - JOUR
U1  - Wissenschaftlicher Artikel
A1  - Vogelwaid, Julian
A1  - Bayer, Martin
A1  - Walz, Michael
A1  - Hampel, Felix
A1  - Kutuzova, Larysa
A1  - Lorenz, Günter
A1  - Kandelbauer, Andreas
A1  - Jacob, Timo
T1  - Optimizing epoxy molding compound processing: a multi-sensor approach to enhance material characterization and process reliability
JF  - Polymers
N2  - The in-line control of curing during the molding process significantly improves product quality and ensures the reliability of packaging materials with the required thermo-mechanical and adhesion properties. The choice of the morphological and thermo-mechanical properties of the molded material, and the accuracy of their determination through carefully selected thermo-analytical methods, play a crucial role in the qualitative prediction of trends in packaging product properties as process parameters are varied. This work aimed to verify the quality of the models and their validation using a highly filled molding resin with an identical chemical composition but 10 wt% difference in silica particles (SPs). Morphological and mechanical material properties were determined by dielectric analysis (DEA), differential scanning calorimetry (DSC), warpage analysis and dynamic mechanical analysis (DMA). The effects of temperature and injection speed on the morphological properties were analyzed through the design of experiments (DoE) and illustrated by response surface plots. A comprehensive approach to monitor the evolution of ionic viscosity (IV), residual enthalpy (dHrest), glass transition temperature (Tg), and storage modulus (E) as a function of the transfer-mold process parameters and post-mold-cure (PMC) conditions of the material was established. The reliability of Tg estimation was tested using two methods: warpage analysis and DMA. The noticeable deterioration in the quality of the analytical signal for highly filled materials at high cure rates is discussed. Controlling the temperature by increasing the injection speed leads to the formation of a polymer network with a lower Tg and an increased storage modulus, indicating a lower density and a more heterogeneous structure due to the high heating rate and shear heating effect.
KW  - dielectric analysis (DEA)
KW  - dynamic mechanical analysis (DMA)
KW  - glass transition temperature (Tg)
KW  - response surface
KW  - heterogeneity
KW  - epoxy molding compound (EMC)
KW  - monitoring
Y1  - 2024
UN  - https://nbn-resolving.org/urn:nbn:de:bsz:rt2-opus4-51168
SN  - 2073-4360
SS  - 2073-4360
U6  - https://doi.org/10.3390/polym16111540
DO  - https://doi.org/10.3390/polym16111540
VL  - 16
IS  - 11
SP  - 28
S1  - 28
PB  - MDPI
CY  - Basel
ER  -