TY  - JOUR
U1  - Wissenschaftlicher Artikel
A1  - Vogelwaid, Julian
A1  - Hampel, Felix
A1  - Bayer, Martin
A1  - Walz, Michael
A1  - Kutuzova, Larysa
A1  - Lorenz, Günter
A1  - Kandelbauer, Andreas
A1  - Jacob, Timo
T1  - In situ monitoring of the curing of highly filled epoxy molding compounds: the influence of reaction type and silica content on cure kinetic models
JF  - Polymers
N2  - Monitoring of molding processes is one of the most challenging future tasks in polymer processing. In this work, the in situ monitoring of the curing behavior of highly filled EMCs (silica filler content ranging from 73 to 83 wt%) and the effect of filler load on curing kinetics are investigated. Kinetic modelling using the Friedman approach was applied using real-time process data obtained from in situ DEA measurements, and these online kinetic models were compared with curing analysis data obtained from offline DSC measurements. For an autocatalytic fast-reacting material to be processed above the glass transition temperature Tg and for an autocatalytic slow-reacting material to be processed below Tg, time–temperature–transformation (TTT) diagrams were generated to investigate the reaction behavior regarding Tg progression. Incorporating a material containing a lower silica filler content of 10 wt% enabled analysis of the effects of filler content on sensor sensitivity and curing kinetics. Lower silica particle content (and a larger fraction of organic resin, respectively) favored reaction kinetics, resulting in a faster reaction towards Tg1. Kinetic analysis using DEA and DSC facilitated the development of highly accurate prediction models using the Friedman model-free approach. Lower silica particle content resulted in enhanced sensitivity of the analytical method, leading, in turn, to more precise prediction models for the degree of cure.
KW  - dielectric analysis (DEA)
KW  - epoxy molding compound (EMC)
KW  - kinetic modeling
KW  - time–temperature–transformation (TTT) diagram
KW  - glass transition temperature (Tg)
Y1  - 2024
UN  - https://nbn-resolving.org/urn:nbn:de:bsz:rt2-opus4-51215
SN  - 2073-4360
SS  - 2073-4360
U6  - https://doi.org/10.3390/polym16081056
DO  - https://doi.org/10.3390/polym16081056
VL  - 16
IS  - 8
SP  - 26
S1  - 26
PB  - MDPI
CY  - Basel
ER  -