TY  - CHAP
U1  - Konferenzveröffentlichung
A1  - Bigalke, Steve
A1  - Lienig, Jens
A1  - Jerke, Göran
A1  - Scheible, Jürgen
A1  - Jancke, Roland
ED  - Bahar, Iris
T1  - The need and opportunities of electromigration-aware integrated circuit design
T2  - Proceedings of the International Conference on Computer-Aided Design ICCAD '18
N2  - Electromigration (EM) is becoming a progressively severe reliability challenge due to increased interconnect current densities. A shift from traditional (post-layout) EM verification to robust (pro-active) EM aware design - where the circuit layout is designed with individual EM-robust solutions - is urgently needed. This tutorial will give an overview of EM and its effects on the reliability of present and future integrated circuits (ICs). We introduce the physical EM process and present its specific characteristics that can be affected during physical design. Examples of EM countermeasures which are applied in today’s commercial design flows are presented. We show how to improve the EM-robustness of metallization patterns and we also consider mission proiles to obtain application-oriented current density limits. The increasing interaction of EM with thermal migration is investigated as well. We conclude with a discussion of application examples to shift from the current post layout EM verification towards an EM aware physical design process. Its methodologies, such as EM-aware routing, increase the EM-robustness of the layout with the overall goal of reducing the negative impact of EM on the circuit’s reliability.
KW  - reliability
KW  - electromigration
KW  - current density
KW  - thermal migration
Y1  - 2018
SN  - 978-1-4503-5950-4
SB  - 978-1-4503-5950-4
U6  - https://doi.org/10.1145/3240765.3265971
DO  - https://doi.org/10.1145/3240765.3265971
SP  - 8
S1  - 8
PB  - ACM
CY  - New York
ER  -