TY  - CPAPER
U1  - Konferenzveröffentlichung
A1  - Pham, Gimi
A1  - Pfost, Martin
T1  - Efficient simulation of thermo-mechanical stress in the on-chip metallization of power semiconductors
T2  - 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) : 19 - 22 April 2015, Budapest
N2  - Large power semiconductors are complex structures, their metallization usually containing many thousands of contacts or vias. Because of this, detailed FEM simulations of the whole device are nowadays not possible because of excessive simulation time. 
This paper introduces a simulation approach which allows quick identification of critical regions with respect to lifetime by a simplified simulation. For this, the complex layers are replaced by a much simpler equivalent layer, allowing a simulation of the whole device even including its package. In a second step, precise simulations taking all details of the structure into account are carried out, but only for the critical regions of interest. Thus, this approach gives detailed results where required with consideration of the whole structure including packaging. Further, the simulation time requirements are very moderate.
Y1  - 2015
SN  - 978-1-4799-9951-4
SB  - 978-1-4799-9951-4
U6  - https://doi.org/10.1109/EuroSimE.2015.7103146
DO  - https://doi.org/10.1109/EuroSimE.2015.7103146
SP  - 1
EP  - 4
S1  - 4
PB  - IEEE
CY  - Piscataway, NJ
ER  -