@article{EnglertStiedlGreenetal.2021,
  author    = {Tim Englert and Jan Stiedl and Simon Green and Timo Jacob and Thomas Chass{\'e} and Karsten Rebner},
  title     = {Quantifying flux residues after soldering on technical copper using ultraviolet visible (UV–Vis) spectroscopy and multivariate analysis},
  journal   = {Microelectronics reliability},
  volume    = {125},
  doi       = {10.1016/j.microrel.2021.114367},
  year        = {2021},
}