Volltext-Downloads (blau) und Frontdoor-Views (grau)
The search result changed since you submitted your search request. Documents might be displayed in a different sort order.
  • search hit 85 of 846
Back to Result List

Temperature profiles along bonding wires, revealed by the Bond Calculator, a new thermo-electrical simulation tool

  • When a bonding wire becomes too hot, it fuses and fails. The ohmic heat that is generated in the wire can be partially dissipated to a mold package. For this cooling effect the thermal contact between wire and package is an important parameter. Because this parameter can degrade over lifetime, the fusing of a bonding wire can also occur as a long-term effect. Another important factor is the thermal power generated in the vicinity of the bond pads. Nowadays, the reliability of bond wires relies on robust dimensioning based on estimations. Smaller package sizes increase the need for better predictive methods. The Bond Calculator, a new thermo-electrical simulation tool, is able to predict the temperature profiles along bond wires of arbitrary dimensions in dependence on the applied arbitrary transient current profile, the mold surrounding the wire, and the thermal contact between wire and mold. In this paper we closely investigated the spatial temperature profiles along different bond wires in air in order to make a first step towards the experimental verification of the simulation model. We are using infrared microscopy in order to measure the thermal radiation generated along the bond wire. This is easier to perform quantitatively in air than in the mold package, because of the non-negligible absorbance of the mold material in the infrared wavelength region.

Download full text files

  • 831.pdf
    eng

Export metadata

Additional Services

Search Google Scholar

Statistics

frontdoor_oas
Metadaten
Author of HS ReutlingenJung, Carl Christoph; Scheible, Jürgen
DOI:https://doi.org/10.1109/EuroSimE.2015.7103148
ISBN:978-1-4799-9951-4
Erschienen in:2015 16th International Conference on Thermal. Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) : 19 - 22 April 2015, Budapest
Publisher:IEEE
Place of publication:Piscataway, NJ
Document Type:Conference proceeding
Language:English
Publication year:2015
Page Number:9
First Page:1
Last Page:9
DDC classes:537 Elektrizität, Elektronik
Open access?:Nein
Licence (German):License Logo  In Copyright - Urheberrechtlich geschützt