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Temperature profiles along bonding wires, revealed by the Bond Calculator, a new thermo-electrical simulation tool

  • When a bonding wire becomes too hot, it fuses and fails. The ohmic heat that is generated in the wire can be partially dissipated to a mold package. For this cooling effect the thermal contact between wire and package is an important parameter. Because this parameter can degrade over lifetime, the fusing of a bonding wire can also occur as a long-term effect. Another important factor is the thermal power generated in the vicinity of the bond pads. Nowadays, the reliability of bond wires relies on robust dimensioning based on estimations. Smaller package sizes increase the need for better predictive methods. The Bond Calculator, a new thermo-electrical simulation tool, is able to predict the temperature profiles along bond wires of arbitrary dimensions in dependence on the applied arbitrary transient current profile, the mold surrounding the wire, and the thermal contact between wire and mold. In this paper we closely investigated the spatial temperature profiles along different bond wires in air in order to make a first step towards the experimental verification of the simulation model. We are using infrared microscopy in order to measure the thermal radiation generated along the bond wire. This is easier to perform quantitatively in air than in the mold package, because of the non-negligible absorbance of the mold material in the infrared wavelength region.

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Author of HS ReutlingenJung, Carl Christoph; Scheible, Jürgen
Erschienen in:2015 16th International Conference on Thermal. Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) : 19 - 22 April 2015, Budapest
Place of publication:Piscataway, NJ
Document Type:Conference proceeding
Publication year:2015
Page Number:9
First Page:1
Last Page:9
DDC classes:537 Elektrizität, Elektronik
Open access?:Nein
Licence (German):License Logo  In Copyright - Urheberrechtlich geschützt