Volltext-Downloads (blau) und Frontdoor-Views (grau)

Technology know-how: from silicon to devices

  • We discuss the fabrication technologies for IC chips in this chapter. We will focus on the main process steps and especially on those aspects that are of particular importance for understanding how they affect, and in some cases drive, the layout of ICs. All our analyses in this chapter will be for silicon as the base material; the principles and understanding gained can be applied to other substrates as well. Following a brief introduction to the fundamentals of IC fabrication (Sect. 2.1) and the base material used in it, namely silicon (Sect. 2.2), we discuss the photolithography process deployed for all structuring work in Sect. 2.3. We will then present in Sect. 2.4 some theoretical opening remarks on typical phenomena encountered in IC fabrication. Knowledge of these phenomena is very useful for understanding the process steps we cover in Sects. 2.5–2.8. We examine a simple exemplar process in Sect. 2.9 and observe how a field-effect transistor (FET) – the most important device in modern integrated circuits—is created. To drive the key points home, we provide a review of each topic at the end of every section from the point of view of layout design by discussing relevant physical design aspects.

Download full text files

  • 3057.pdf

Export metadata

Additional Services

Search Google Scholar


Author of HS ReutlingenScheible, Jürgen
Editor of HS ReutlingenScheible, Jürgen
Erschienen in:Fundamentals of layout design for electronic circuits
Place of publication:Cham
Editor:Jens Lienig, Jürgen ScheibleORCiD
Document Type:Book chapter
Publication year:2020
Page Number:52
First Page:31
Last Page:82
PPN:Im Katalog der Hochschule Reutlingen ansehen
PPN:Im Katalog der Hochschule Reutlingen ansehen
DDC classes:620 Ingenieurwissenschaften und Maschinenbau
Open access?:Nein
Licence (German):License Logo  In Copyright - Urheberrechtlich geschützt