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IC layout automation with self-organized wiring and arrangement of responsive modules (SWARM)
(2019)
Focused on automating analog IC layout, the multi-agent-system Self-organized Wir ing and Arrangement of Responsive Modules (SWARM) combines the powers of pro-cedural generators and algorithmic optimization into a novel bottom-up meets top-down flow of supervised layout module interaction. Provoking self-organization via the effect of emergence, examples show SWARM finding even optimal placement solutions and producing constraint-compliant layout blocks which fit into a specified zone.
In this paper, we address the novel EDP (Expert Design Plan) principle for procedural design automation of analog integrated circuits, which captures the knowledge-based design strategy of human circuit designers in an executable script, making it reusable. We present the EDP Player, which enables the creation and execution of EDPs for arbitrary circuits in the Cadence® Virtuoso® Design Environment. The tool provides a generic version of an instruction set, called EDPL (EDPLanguage), enabling emulation of a typical manual analog sizing flow. To automate the design of a Miller Operational Amplifier and to create variants of a Smart Power IC, several EDPs were implemented using this tool. Employing these EDPs leads to a strong reduction of design time without compromising design quality or reliability.
Anders als Digital-ICs, die hochautomatisiert entworfen werden können, ist der Entwurf analoger ICs bis heute Handarbeit. Übliche auf Optimierung basierende Automatisierungsverfahren scheitern. Die Ursachen wurden jetzt in einem Forschungsprojekt untersucht, um neue Ansätze zur Entwurfsautomatisierung analoger ICs abzuleiten.
Nowadays, the demand for a MEMS development/design kit (MDK) is even more in focus than ever before. In order to achieve a high quality and cost effectiveness in the development process for automotive and consumer applications, an advanced design flow for the MEMS (micro electro mechanical systems) element is urgently required. In this paper, such a development methodology and flow for parasitic extraction of active semiconductor devices is presented. The methodology considers geometrical extraction and links the electrically active pn junctions to SPICE standard library models and subsequently extracts the netlist. An example for a typical pressure sensor is presented and discussed. Finally, the results of the parasitic extraction are compared with fabricated devices in terms of accuracy and capability.
Due to the lack of sophisticated component libraries for microelectromechanical systems (MEMS), highly optimized MEMS sensors are currently designed using a polygon driven design flow. The advantage of this design flow is its accurate mechanical simulation, but it lacks a method for an efficient and accurate electrostatic analysis of parasitic effects of MEMS. In order to close this gap in the polygon-driven design flow, we present a customized electrostatic analysis flow for such MEMS devices. Our flow features a 2.5D fabrication-process simulation, which simulates the three typical MEMS fabrication steps (namely deposition of materials including topography, deep reactive-ion etching, and the release etch by vapor-phase etching) very fast and on an acceptable abstraction level. Our new 2.5D fabrication-process simulation can be combined with commercial field-solvers such as they are commonly used in the design of integrated circuits. The new process simulation enables a faster but nevertheless satisfactory analysis of the electrostatic parasitic effects, and hence simplifies the electrical optimization of MEMS.