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Analog integrated circuit sizing still relies heavily on human expert knowledge as previous automation approaches have not found wide-spread acceptance in industry. One strand, the optimization-based automation, is often discarded due to inflated constraining setups, infeasible results or excessive run times. To address these deficits, this work proposes a alternative optimization flow featuring a designer’s intuition for feasible design spaces through integration of expert knowledge based on the gm/ID-method. Moreover, the extensive run times of simulation-based optimization flows are overcome by incorporating computationally efficient machine learning methods. Neural network surrogate models predicting eleven performance parameters increase the evaluation speed by 3 400× on average compared to a simulator. Additionally, they enable the use of optimization algorithms dependent on automatic differentiation, that would otherwise be unavailable in this field. First, an up to 4× more efficient way for sampling training data based on the aforementioned space is detailed. After presenting the architecture and training effort regarding the surrogate models, they are employed as part of the objective function for sizing three operational amplifiers with three different optimization algorithms. Additionally, the benefits of using the gm/ID-method become evident when considering technology migration, as previously found solutions may be reused for other technologies.
This paper presents a machine learning powered, procedural sizing methodology based on pre-computed look-up tables containing operating point characteristics of primitive devices. Several Neural Networks are trained for 90nm and 45nm technologies, mapping different electrical parameters to the corresponding dimensions of a primitive device. This transforms the geometric sizing problem into the domain of circuit design experts, where the desired electrical characteristics are now inputs to the model. Analog building blocks or entire circuits are expressed as a sequence of model evaluations, capturing the sizing strategy and intention of the designer in a procedure, which is reusable across different technology nodes. The methodology is employed for the sizing of two operational amplifiers, and evaluated for two technology nodes, showing the versatility and efficiency of this approach.
There is still a great reliance on human expert knowledge during the analog integrated circuit sizing design phase due to its complexity and scale, with the result that there is a very low level of automation associated with it. Current research shows that reinforcement learning is a promising approach for addressing this issue. Similarly, it has been shown that the convergence of conventional optimization approaches can be improved by transforming the design space from the geometrical domain into the electrical domain. Here, this design space transformation is employed as an alternative action space for deep reinforcement learning agents. The presented approach is based entirely on reinforcement learning, whereby agents are trained in the craft of analog circuit sizing without explicit expert guidance. After training and evaluating agents on circuits of varying complexity, their behavior when confronted with a different technology, is examined, showing the applicability, feasibility as well as transferability of this approach.
Im Vergleich zum digitalen Layoutentwurf weist der analoge Layoutentwurf einen wesentlich geringeren Automatisierungsgrad auf. Dies gilt insbesondere für den Layoutentwurf von Hochfrequenzschaltungen, wo Einflüsse der lokalen Layoutumgebung besonders zu berücksichtigen sind. Bei dieser sog. Kontextabhängigkeit geraten sowohl Optimierungsalgorithmen als auch herkömmliche Generatoransätze schnell an Grenzen. In dieser Arbeit wird eine funktionale Erweiterung des bekannten Generatorprinzips eingesetzt, die es erlaubt, Informationen aus der Layoutumgebung der Instanz in die Layoutgenerierung einzubeziehen. Mit dieser sog. kontextbasierten PCell gelingt die Automatisierung konkreter, bisher nur manuell lösbarer Probleme des Layoutentwurfs von Hochfrequenzschaltungen. Die Arbeit zeigt das Potential kontextbasierter PCells für die weitere Steigerung des Automatisierungsgrades im analogen Layoutentwurf.
In this paper, we address the novel EDP (Expert Design Plan) principle for procedural design automation of analog integrated circuits, which captures the knowledge-based design strategy of human circuit designers in an executable script, making it reusable. We present the EDP Player, which enables the creation and execution of EDPs for arbitrary circuits in the Cadence® Virtuoso® Design Environment. The tool provides a generic version of an instruction set, called EDPL (EDPLanguage), enabling emulation of a typical manual analog sizing flow. To automate the design of a Miller Operational Amplifier and to create variants of a Smart Power IC, several EDPs were implemented using this tool. Employing these EDPs leads to a strong reduction of design time without compromising design quality or reliability.
This paper presents an improvement in usability and integrity of simulation-based analog circuit sizing. Instead of using geometrical sizing parameters (width, length), a transformed design-space, consisting exclusively of electrical parameters (branch currents, efficiencies and speed) is utilized. This design-space is explored more efficiently by optimizers. Moreover, this design-space can be reduced without affecting the quality of the result. The method is illustrated on two application examples, a symmetrical and a miller operational amplifier. Sizing the circuits using the transformed design-space showed significant reduction in required circuit simulations (up to 11x faster), better convergence, without loss in quality.
This paper presents a toolbox in Matlab/Octave for procedural design of analog integrated circuits. The toolbox contains all native functions required by analog designers (namely, schematic-generation, simulation setup and execution, integrated look-up tables and functions for design space exploration) to capture an entire design strategy in an executable script. This script - which we call an Expert Design Plan (EDP) - is capable of executing an analog circuit design fully automatically. The toolbox is integrated in an existing design flow. A bandgap reference voltage circuit is designed with this tool in less than 15 min.
Physical analog IC design has not been automated to the same degree as digital IC design. This shortfall is primarily rooted in the analog IC design problem itself, which is considerably more complex even for small problem sizes. Significant progress has been made in analog automation in several R&D target areas in recent years. Constraint engineering and generator-based module approaches are among the innovations that have emerged. Our paper will first present a brief review of the state of the art of analog layout automation. We will then introduce active and open research areas and present two visions – a “continuous layout design flow” and a “bottom-up meets top-down design flow” – which could significantly push analog design automation towards its goal of analog synthesis.
The vast majority of state-of-the-art integrated circuits are mixed-signal chips. While the design of the digital parts of the ICs is highly automated, the design of the analog circuitry is largely done manually; it is very time-consuming; and prone to error. Among the reasons generally listed for this is often the attitude of the analog designer. The fact is that many analog designers are convinced that human experience and intuition are needed for good analog design. This is why they distrust the automated synthesis tools. This observation is quite correct, but this is only a symptom of the real problem. This paper shows that this phenomenon is caused by very concrete technical (and thus very rational) issues. These issues lie in the mode of operation of the typical optimization processes employed for the synthesizing tasks. I will show that the dilemma that arises in analog design with these optimizers is the root cause of the low level of automation in analog design. The paper concludes with a review of proposals for automating analog design
In analog layout design, chip floorplans are usually still handcrafted by human experts. Particularly, the nondiscrete variability of block dimensions must be exploited thereby, which is a serious challenge for optimization-based algorithmic floorplanners. This paper presents a fundamentally new automation approach based on self-organization, in which floorplan blocks can autonomously move, rotate and deform themselves to jointly let compact results emerge from a synergistic flow of interaction. Our approach is able to minimize area and wirelength, supports nonslicing floorplan structures, can consider fully variable block dimensions, accounts for a fixed rectilinear boundary, and works absolutely deterministic. The approach is innovatively different from conventional, top-down oriented floorplanning algorithms.
This paper enhances SWARM, a novel deterministic analog layout automation approach based on the idea of cellular automata. SWARM implements a decentralized interaction model in which responsive layout modules, covering basic circuit types, autonomously move, rotate and deform themselves to let constraint-compliant, compact layout solutions emerge from a synergetic flow of self-organization. With the ability to consider design constraints both implicitly and explicitly, SWARM joins the layout quality of procedural generators with the flexibility of optimization algorithms, combining these two kinds of automation into a “bottom-up meets top-down” flow. The new enhancements are demonstrated in an OTA example, depicting the power of SWARM and its enormous potential for future developments.
In practice, the use of layout PCells for analog IC design has not advanced beyond primitive devices and simple modules. This paper introduces a Constraint-Administered PCell-Applying Blocklevel Layout Engine (CAPABLE) which permits PCells to access their context, thus enabling a true "bottom-up" development of complex parameterized modules. These modules are integrated into the design flow with design constraints and applied by an execution cockpit via an automatically built layout script. The practical purpose of CAPABLE is to easily generate full-custom block layouts for given schematic circuits. Perspectively, our results inspire a whole new conception of PCells that can not only act (on demand), but also react (to environmental changes) and interact (with each other).
IC layout automation with self-organized wiring and arrangement of responsive modules (SWARM)
(2019)
Focused on automating analog IC layout, the multi-agent-system Self-organized Wir ing and Arrangement of Responsive Modules (SWARM) combines the powers of pro-cedural generators and algorithmic optimization into a novel bottom-up meets top-down flow of supervised layout module interaction. Provoking self-organization via the effect of emergence, examples show SWARM finding even optimal placement solutions and producing constraint-compliant layout blocks which fit into a specified zone.
Electronic design automation approaches can roughly be divided into optimizers and procedures. While the former have enabled highly automated synthesis flows for digital integrated circuits, the latter play a vital (but mostly underestimated role) in the analog domain. This paper describes both automation strategies in comparison, identifying two fundamentally different automation paradigms that reflect the two basic design practices known as “top-down” and “bottom-up”. Then, with a focus on the latter, the history of procedural approaches is traced from their
early beginnings until today’s evolvements and future prospects to underline their practical importance and to accentuate their scientific value, both in itself and in the overall context of EDA.
While digital IC design is highly automated, analog circuits are still handcrafted in a time-consuming, manual fashion today. This paper introduces a novel Parameterized Circuit Description Scheme (PCDS) for the development of procedural analog schematic generators as parameterized circuits. Circuit designers themselves can use PCDS to create circuit automatisms which capture valuable expert knowledge, offer full topological flexibility, and enhance the re-use of well-established topologies. The generic PCDS concept has been successfully implemented and employed to create parameterized circuits for a broad range of use cases. The achieved results demonstrate the efficiency of our PCDS approach and the potential of parameterized circuits to increase automation in circuit design, also to benefit physical design by promoting the common schematic-driven-layout flow, and to enhance the applicability of circuit synthesis approaches.
The limited interfaces of today's IC design environments for editing PCell parameters hinder a solid advancement towards more complex analog PCell modules. This paper presents Hierarchical Instance Parameter Editing (HIPE), a highly flexible concept for the customization of PCell sub-instances. Introducing a new type of parameter, HIPE facilitates the dynamic creation of multi-level editing forms reflecting the actual contents of a PCell instance. This approach greatly improves a PCell's ease-of-use, substantially simplifies PCell development, and allows for a hierarchical execution of parameter validation callbacks. Our HIPE implementation has been integrated into a professional PCell development tool and represents a key enabling technology for upcoming generations of high-level hierarchical PCells.
A procedural approach to automate the manual design process in analog integrated circuit design
(2018)
This paper presents a novel approach to automating the design of analog integrated circuits: (1) the Expert Design Plan (EDP), a procedural generator, and (2) the EDP Language, a high-level description language for writing an EDP. An EDP is a parameterizable, executable script, which reproduces a designer’s course of action when designing a circuit. Thus, an EDP formalizes the design expert’s knowledge-based strategy and makes it reusable. Since it is essential that an EDP represents a circuit designers’ way of thinking and working as close as possible, the designers themselves should be enabled to create the EDP. Therefore, our approach provides a input method through a domain-specific language called EDP Language (EDPL). Using this language is intuitive and requires no special training. In an exemplary implementation of our approach, a common-source amplifier is automatically sized using a set of only 10 instructions. Even in the first usage our EDP approach has appeared to be more efficient than the manual sizing process.
Layout generators, commonly denoted as PCells (parameterized cells), play an important role in the layout design of analog ICs (integrated circuits). PCells can automatically create parts of a layout, whose properties are controlled by the PCell parameters. Any layout, whether hand-crafted or automatically generated, has to be verified against design rules using a DRC (design rule check) in order to assure proper functionality and producibility. Due to the growing complexity of today’s PCells it would be beneficial if a PCell itself could be ensured to produce DRC clean layouts for any allowed parameter values, i.e. a formal verification of the PCell’s code rather than checking all possible instances of the PCell. In this paper we demonstrate the feasibility of such a formal PCell verification for a simple NMOS transistor PCell. The set from which the parameter values can be chosen was found during the verification process.
Eine neue Methode zur Berechnung von Temperaturen in Bonddrähten umgeben von einem endlichen Mold wird vorgestellt. Sie ist schneller als die übliche Finite Elemente-Methode (FEM), während sie vergleichbare Resultate produziert. Für manche Parameter funktioniert unsere Methode, während die FEM-Methode versagt. Der Algorithmus ist im sogenannten Bondrechner implementiert, der eine leicht zu benutzende Oberfläche für Designer von mikroelektronischen Systemen bereitstellt. Seine Anwendung hat das Potential, die Zuverlässigkeit von Bonddrähten zu verbessern. Ein nichtidealer Parameter für den Wärmetransfer vom Bonddraht zum Mold-Package wurde ebenfalls berücksichtigt. Dieser Parameter ändert sich wahrscheinlich unter Alterseinflüssen und ist daher sehr wichtig für Zuverlässigkeits-Schätzungen. In unserer Methode wird die Wechselwirkung von Nachbardrähten ebenfalls berücksichtigt. Diese wird immer wichtiger, weil der Durchmesser und der wechselseitige Abstand der Bonddrähte sich verringert, wegen der fortschreitenden Miniaturisierung der Chip-Verpackungen. Unser Programm kann ebenfalls Temperaturen für transiente Ströme berechnen und den Strom berechnen, der zu einer gegebenen Maximaltemperatur gehört.
When a bonding wire becomes too hot, it fuses and fails. The ohmic heat that is generated in the wire can be partially dissipated to a mold package. For this cooling effect the thermal contact between wire and package is an important parameter. Because this parameter can degrade over lifetime, the fusing of a bonding wire can also occur as a long-term effect. Another important factor is the thermal power generated in the vicinity of the bond pads. Nowadays, the reliability of bond wires relies on robust dimensioning based on estimations. Smaller package sizes increase the need for better predictive methods.
The Bond Calculator, a new thermo-electrical simulation tool, is able to predict the temperature profiles along bond wires of arbitrary dimensions in dependence on the applied arbitrary transient current profile, the mold surrounding the wire, and the thermal contact between wire and mold.
In this paper we closely investigated the spatial temperature profiles along different bond wires in air in order to make a first step towards the experimental verification of the simulation model. We are using infrared microscopy in order to measure the thermal radiation generated along the bond wire. This is easier to perform quantitatively in air than in the mold package, because of the non-negligible absorbance of the mold material in the infrared wavelength region.