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In dieser Arbeit wird eine optimierte Bandgap-Referenz zur Erzeugung einer temperaturstabilen Spannung und eines Referenzstroms vorgestellt. Für Low-Power-Anwendungen wurde die Bandgap-Referenz, basierend auf der Brokaw-Zelle, mit minimaler Stromaufnahme und optimierter Chipfläche durch Multi-Emitter-Layout der Bipolartransistoren implementiert. Zusätzliches Merkmal ist ein verbreiteter Versorgungsspannungsbereich von 2,5 bis 5,5 V. Simulationen zeigen, dass eine stabile Ausgangsspannung von 1,218 V und ein Referenzstrom von 1,997 μA realisiert wird. Im Temperaturbereich -40 °C … 50 °C sowie dem gesamten Bereich der Versorgungsspannung beträgt die Genauigkeit der Referenzspannung ± 0,04 % mit einer Gesamtstromaufnahme zwischen 3,5 und 10 μA. Es wird eine Temperaturdrift von 2,18 ppm/K erreicht. Durch das elektronische Trimmen von Widerständen wird der Offset der Ausgangsspannung, bedingt durch Herstellungstoleranzen, auf ±3,5 mV justiert. Die Referenz wird in einer 0,18 μm BiCMOS-Technologie implementiert.
A millimeter-wave power amplifier concept in an advanced silicon germanium (SiGe) BiCMOS technology is presented. The goal of the concept is to investigate the impact of physical limitations of the used heterojunction bipolar transistors (HBT) on the performance of a 77 GHz power amplifier. High current behavior, collectorbase breakdown and transistor saturation can be forced with the presented design. The power amplifier is manufactured in an advanced SiGe BiCMOS technology at Infineon Technologies AG with a maximum transit frequency fT of around 250 GHz for npn HBT’s [1]. The simulation results of the power amplifier show a saturated output power of 16 dBm at a power added efficiency of 13%. The test chip is designed for a supply voltage of 3.3 V and requires a chip size of 1.448 x 0.930 mm².
Size and cost of a switched mode power supply can be reduced by increasing the switching frequency. The maximum switching frequency and the maximum conversion ratio are limited by the duty cycle of a PWM signal. In DCDC converters, a sawtooth generator is the fundamental circuit block to generate the PWM signal. The presented PWM generator is based on two parallel, fully interleaved PWM generator stages, each containing an integrator based sawtooth generator and two 3-stage highspeed comparators. A digital multiplexing of the PWM signals of each stage eliminates the dependency of the minimum on-time on the large reset times of the sawtooth ramps. A separation of the references of the PWM comparators in both stage allows to configure the PWM generator for a DCDC converter operating in fixed frequency or in constant on-time mode, which requires an operation in a wide frequency range. The PWM generator was fabricated in an 180 nm HV BiCMOS technology, as part of a DCDC converter. Measurements confirm minimum possible ontime pulses as short as 2 ns and thus allows switching frequencies of DCDC converters of >50 MHz at small duty cycle of <10%. At moderate duty cycles switching frequencies up to 100 MHz are possible.
Size and cost of a switched mode power supply can be reduced by increasing the switching frequency. The maximum switching frequency and the maximum input voltage range, respectively, is limited by the minimum propagated on-time pulse, which is mainly determined by the level shifter speed. At switching frequencies above 10 MHz, a voltage conversion with an input voltage range up to 50 V and output voltages below 5 V requires an on-time of a pulse width modulated signal of less than 5 ns. This cannot be achieved with conventional level shifters. This paper presents a level shifter circuit, which controls an NMOS power FET on a high-voltage domain up to 50 V. The level shifter was implemented as part of a DCDC converter in a 180 nm BiCMOS technology. Experimental results confirm a propagation delay of 5 ns and on-time pulses of less than 3 ns. An overlapping clamping structure with low parasitic capacitances in combination with a high-speed comparator makes the level shifter also very robust against large coupling currents during high-side transitions as fast as 20 V/ns, verified by measurements. Due to the high dv/dt, capacitive coupling currents can be two orders of magnitude larger than the actual signal current. Depending on the conversion ratio, the presented level shifter enables an increase of the switching frequency for multi-MHz converters towards 100 MHz. It supports high input voltages up to 50 V and it can be applied also to other high-speed applications.
Substrate coupling is a critical failure mechanism especially in fast-switching integrated power stages controlling high-side NMOS power FETs. The parasitic coupling across the substrate in integrated power stages at rise times of up to 500 ps and input voltages of up to 40V is investigated in this paper. The coupling has been studied for the power stage of an integrated buck converter. In particular, dedicated diverting and isolation structures against substrate coupling are analyzed by simulations and evaluated with measurements from test chips in 180nm high-voltage BiCMOS. The results are compared regarding effectiveness, area as well as implementation effort and cost. Back-side metalization shows superior characteristics with nearly 100% noise suppression. Readily available p-guard ring structures bring 75% disturbance reduction. The results are applicable to advanced and future power management solutions with fully integrated switched-mode power supplies at switching frequencies >10 MHz.
The presented wide-Vin step-down converter introduces a parallel-resonant converter (PRC), comprising an integrated 5-bit capacitor array and a 300 nH resonant coil, placed in parallel to a conventional buck converter. Unlike conventional resonant concepts, the implemented soft-switching control eliminates input voltage dependent losses over a wide operating range. This ensures high efficiency across a wide range of Vin= 12-48V, 100-500mA load and 5V output at up to 15MHz switching frequency. The peak efficiency of the converter is 76.3 %. Thanks to the low output current ripple, the output capacitor can be as small as 50 nF, while the inductor tolerates a larger ESR, resulting in small component size. The proposed PRC architecture is also suitable for future power electronics applications using fast-switching GaN devices.
This paper presents an integrated synchronous buck converter for input voltages >12V with 10MHz switching frequency. The converter comprises a predictive dead time control with frequency compensated sampling of the switching node which does not require body diode forward conduction. A high dead time resolution of 125 ps is achieved by a differential delay chain with 8-bit resolution. This way, the efficiency of fast switching DCDC converters can be optimized by eliminating the body diode forward conduction losses, minimizing reverse recovery losses and by achieving zero voltage switching at turn off. The converter was implemented in a 180nm high-voltage BiCMOS technology. The power losses were measured to be reduced by 30%by the proposed dead time control, which results in a 6% efficiency increase at VOUT = 5V and 0.2A load. The peak efficiency is 81 %.
More and more power electronics applications utilize GaN transistors as they enable higher switching frequencies in comparison to conventional Si devices. Faster switching shrinks down the size of passives and enables compact solutions in applications like renewable energy, electrical cars and home appliances. GaN transistors benefit from ~10× smaller gate charge QG and gate drive voltages in the range of typically 5V vs. ~15V for Si.
Due to their superior fast-switching performance, GaN transistors show enormous potential to enable compact power electronics in applications like renewable energy, electrical cars and home appliances by shrinking down the size of passives. However, fast switching poses challenges for the gate driver. Since GaN transistors have a low threshold voltage Vt of ~1V, an unintended driver turn-on can occur in case of a unipolar gate control as shown for a typical half-bridge in Fig. 24.2.1 (top left). This is due to coupling via the gate-drain capacitance (Miller coupling), when the low-side driver turns on, causing a peak current into the gate. This is usually tackled by applying a negative gate voltage to enhance the safety margin towards Vt, resulting in a bipolar gate-driving scheme. In many power-electronics applications GaN transistors operate in reverse conduction, carrying the inductor current during the dead time t, when the high-side and low-side switch are off (as illustrated at a high-side switch in Fig. 24.2.1, bottom left). As there is no real body diode as in silicon devices, the GaN transistor turns on in reverse operation with a voltage drop VF across the drain-source terminals (quasi-body diode behavior). As a negative gate voltage adds to VF, 63% higher reverse-conduction losses were measured for a typical GaN switch in bipolar gate-drive operation. This drawback is addressed by a three-level gate voltage (positive, 0V, negative), which at the same time provides robustness against unintended turn-on similar to the bipolar gate driver, proven in [1] for a discrete driver.
This work presents a fully integrated GaN gate driver in a 180nm HV BCD technology that utilizes high-voltage energy storing (HVES) in an on-chip resonant LC tank, without the need of any external capacitor. It delivers up to 11nC gate charge at a 5V GaN gate, which exceeds prior art by a factor of 45-83, supporting a broad range of GaN transistor types. The stacked LC tank covers an area of only 1.44mm², which corresponds to a superior value of 7.6nC/mm².
Es wird ein hochintegrierter Gatetreiber für 600V-Anwendungen mit einer galvanischen Isolation zwischen der Ansteuerelektronik und der Treiberseite vorgestellt. Eine Besonderheit ist die bidirektionale Signalübertragung und die Energieversorgung über einen einzigen Transformator. Die Treiberansteuersignale werden mittels 10/20 MHz Frequenzmodulation übertragen. Die Signalrückübertragung ist in Form einer 1Mbit/s Amplitudenmodulation realisiert. Die Energieübertragung über den Transformator erlaubt ein dauerhaftes Einschalten des Treibers. Der Energiebedarf während des Schaltvorgangs wird hauptsächlich durch eine Bootstrapschaltung bereitgestellt. Eine weitere Besonderheit ist die Verwendung einer flächeneffizienten Integration einer NMOS Treiberausgangsstufe. Der Gatetreiber wurde in einer 180nm Hochvolt-BiCMOS-Technologie hergestellt. Messungen bestätigen die Funktion des Treibers.
Bootstrap circuits are mainly used for supplying a gate driver circuit to provide the gate overdrive voltage for a high-side NMOS transistor. The required charge has to be provided by a bootstrap capacitor which is often too large for integration if an acceptable voltage dip at the capacitor has to be guaranteed. Three options of an area efficient bootstrap circuit for a high side driver with an output stage of two NMOS transistors are proposed. The key idea is that the main bootstrap capacitor is supported by a second bootstrap capacitor, which is charged to a higher voltage and connected when the gate driver turns on. A high voltage swing at the second capacitor leads to a high charge allocation. Both bootstrap capacitors require up to 70% less area compared to a conventional bootstrap circuit. This enables compact power management systems with fewer discrete components and smaller die size. A calculation guideline for optimum bootstrap capacitor sizing is given. The circuit was manufactured in a 180nm high-voltage BiCMOS technology as part of a high-voltage gate driver. Measurements confirm the benefit of high-voltage charge storing. The fully integrated bootstrap circuit including two stacked 75.8pF and 18.9pF capacitors results in a voltage dip lower than 1V. This matches well with the theory of the calculation guideline.
Galvanic isolated gate drivers require a control signal as well as energy transmission from the control side (lowside) to the driver side (high-side). An additional backward signal transmission is preferred for error signals, status information, etc. This is often realized by means of several transformers or opto-couplers. Decreasing the number of isolation elements results in lower cost and a higher degree of miniaturization. This work presents a gate driver with bidirectional signal transmission and energy transfer via one single transformer. The key concept proposed in this paper is to combine bootstrapping to deliver the main gate charge for the driven power switch with additional energy transfer via the signal transformer. This paper also presents a very efficient combination of energy transfer to two high-side supply rails with back channel amplitude modulation. This way an isolated gate driver can be implemented that allows 100% pulse-width modulation (PWM) duty cycle at low complexity and system cost. The proposed high-side driver IC with integrated power supply, modulation and demodulation circuits was manufactured in a 180nm high-voltage BiCMOS technology. Measurements confirm the concept of bidirectional signal transmission with a 1MBit/s amplitude modulation, 10/20MHz frequency modulation and a maximum power transmission of 14mW via the transformer.
Modern power transistors are able to switch at very high transition speed, which can cause EMC violations and overshoot. This is addressed by a gate driver with variable gate current, which is able to control the transition speed. The key idea is that the gate driver can influence the di/dt and dv/dt transition separately and optimize whichever transition promises the highest improvement while keeping switching losses low. To account for changes in the load current, supply voltage, etc., a control loop is required in the driver to ensure optimized switching. In this paper, an efficient control scheme for an automotive gate driver with variable output current capability is presented. The effectiveness of the control loop is demonstrated for a MOSFET bridge consisting of OptiMOS-T2™devices with a total gate charge of 39nC. This bridge setup shows dv/dt transitions between 50 to 1000ns, depending on driving current. The driver is able to switch between gate current levels of 1 to 500mA in 10/15ns (rising/falling transition). With the implemented control loop the driver is measured to significantly reduce the ringing and thereby reduce device stress and electromagnetic emissions while keeping switching losses 52% lower than with a constant current driver.
There is a growing need for motor drives with improved EMC in various automotive and industrial applications. An often referenced approach to reduce EME is to change the shape of the switching signal to reduce the EMI caused by the voltage and current transitions. This requires very precise gate control of the power MOSFET to achive better switching behaviour and lower EME without a major increase in switching losses. In order to find an optimal trade-off, this work utilizes a monolithic current mode gate driver with a variable output current that can be changed within 10ns. With this driver, measurements with different gate current profiles were taken. The di/dt transition was confirmed to be as important as the dv/dt transition in the power MOSFET. As a result of the improved switching behavior the emissions were reduced by up to 20dB between 7MHz and 60MHz with a switching loss that is 52% lower than with a constantly low gate current.
The power supply is one of the major challenges for applications like internet of things IoTs and smart home. The maintenance issue of batteries and the limited power level of energy harvesting is addressed by the integrated micro power supply presented in this paper. Connected to the 120/230 Vrms mains, which is one of the most reliable energy sources and anywhere indoor available, it provides a 3.3V DC output voltage. The micro power supply consists of a fully integrated ACDC and DCDC converter with one external low voltage SMD buffer capacitor. The micro power supply is fabricated in a low cost 0.35 μm 700 V CMOS technology and covers a die size of 7.7 mm². The use of only one external low voltage SMD capacitor, results in an extremely compact form factor. The ACDC is a direct coupled, full wave rectifier with a subsequent bipolar shunt regulator, which provides an output voltage around 17 V. The DCDC stage is a fully integrated 4:1 SC DCDC converter with an input voltage as high as 17 V and a peak efficiency of 45 %. The power supply achieves an overall output power of 3 mW, resulting in a power density of 390 μW/mm². This exceeds prior art by a factor of 11.
Durch schnell schaltende Leistungsendstufen werden durch kapazitive Umladeströme Störungen ins Substrat und in empfindliche Schaltungselemente eingekoppelt, die dort zur Störung der Funktion führen können. In dieser Arbeit werden Substratstrukturen zur gezielten Ableitung dieser Störungen vorgestellt und ihre Wirksamkeit mit Hilfe von Device Simulation evaluiert. Ohne Ableitstrukturen kann eine Potentialanhebung des Substrats bis zu 20 V entstehen. Die Untersuchungen belegen, dass die Potentialanhebung durch p-Typ Guard-Ringe um 75 %, durch leitende Trenches um 88 % sowie durch Rückseitenmetallisierung um nahezu 100 % reduziert werden kann.
The efficiency impact of air-cored inductors used close to and beyond its cut-off frequency in multi-MHz converters is investigated. A method is presented to determine the converter switching frequency that causes the lowest losses in a given inductor. Influential parameters are analysed to optimize an inductor for a predefined switching frequency.