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Boost converters suffer from a bandwidth limitation caused by the right-half plane zero (RHPZ), which occurs in the control-to-output transfer function. In contrast, there are many applications that require superior dynamic behavior. Further, size and cost of boost converter systems can be minimized by reduced voltage deviations and fast transient responses in case of large signal load transients. The key idea of the proposed ΔV/Δt-intervention control concept is to adapt the controller output to its new steady state value immediately after a load transient by prediction from known parameters. The concept is implemented in a digital control circuit, consisting of an ASIC in a 110 nm-technology and a Xilinx Spartan-6 field programmable gate array (FPGA). In a boost converter with 3.5V input voltage, 6.3V output voltage, 1.2A load, and 500 kHz switching frequency, the output voltage deviations are 2.8x smaller, scaling down the output capacitor value by the same factor. The recovery times are 2.4x shorter in case of large signal load transients with the proposed concept. The control is widely applicable, as it supports constant switching frequencies and allows for duty cycle and inductor current limitations. It also shows various advantages compared to conventional control and to selected adaptive control concepts.
In recent years, significant progress was made on switched-capacitor DCDC converters as they enable fully integrated on chip power management. New converter topologies overcame the fixed input-to-output voltage limitation and achieved high efficiency at high power densities. SC converters are attractive to not only mobile handheld devices with small input and output voltages, but also for power conversion in IoTs, industrial and automotive applications, etc. Such applications need to be capable of handling high input voltages of more than 10V. This talk highlights the challenges of the required supporting circuits and high voltage techniques, which arise for high Vin SC converters. It includes level shifters, charge pumps and back-to-back switches. High Vin conversion is demonstrated in a 4:1 SC DCDC converter with an input voltage as high as 17V with a peak efficiency of 45 %, and a buckboost SC converter with an input voltage range starting from 2 up to 13V, which utilizes a total of 17 ratios and achieves a peak efficiency of 81.5 %. Furthermore a highly integrated micro power supply approach is introduced, which is connected directly to the 120/230 Vrms mains, with an output power of 3mW, resulting in a power density >390μW/mm², which exceeds prior art by a factor of 11.
Substrate coupling is a critical failure mechanism especially in fast-switching integrated power stages controlling high-side NMOS power FETs. The parasitic coupling across the substrate in integrated power stages at rise times of up to 500 ps and input voltages of up to 40V is investigated in this paper. The coupling has been studied for the power stage of an integrated buck converter. In particular, dedicated diverting and isolation structures against substrate coupling are analyzed by simulations and evaluated with measurements from test chips in 180nm high-voltage BiCMOS. The results are compared regarding effectiveness, area as well as implementation effort and cost. Back-side metalization shows superior characteristics with nearly 100% noise suppression. Readily available p-guard ring structures bring 75% disturbance reduction. The results are applicable to advanced and future power management solutions with fully integrated switched-mode power supplies at switching frequencies >10 MHz.
In a digitally controlled slope shaping system, reliable detection of both voltage and current slope is required to enable a closed-loop control for various power switches independent of system parameters. In most state-of-the-art works, this is realized by monitoring the absolute voltage and current values. Better accuracy at lower DC power loss is achieved by sensing techniques for a reliable passive detection, which is achieved through avoiding DC paths from the high voltage network into the sensing network. Using a high-speed analog-to-digital converter, the whole waveform of the transient derivative can be stored digitally and prepared for a predictive cycle-by-cycle regulation, without requiring high-precision digital differentiation algorithms. To gain an accurate representation of the voltage and current derivative waveforms, system parasitics are investigated and classified in three sections: (1) component parasitics, which are identified by s-parameter measurements and extraction of equivalent circuit models, (2) PCB design issues related to the sensing circuit, and (3) interconnections between adjacent boards.
The contribution of this paper is an optimized sensing network on the basis of the experimental study supporting fast transition slopes up to 100 V/ns and 1 A/ns and beyond, making the sensing technique attractive for slope shaping of fast switching devices like modern generation IGBTs, CoolMOSTM and SiC mosfets. Measurements of the optimized dv/dt and di/dt setups are demonstrated for a hard switched IGBT power stage.
Galvanic isolated gate drivers require a control signal as well as energy transmission from the control side (lowside) to the driver side (high-side). An additional backward signal transmission is preferred for error signals, status information, etc. This is often realized by means of several transformers or opto-couplers. Decreasing the number of isolation elements results in lower cost and a higher degree of miniaturization. This work presents a gate driver with bidirectional signal transmission and energy transfer via one single transformer. The key concept proposed in this paper is to combine bootstrapping to deliver the main gate charge for the driven power switch with additional energy transfer via the signal transformer. This paper also presents a very efficient combination of energy transfer to two high-side supply rails with back channel amplitude modulation. This way an isolated gate driver can be implemented that allows 100% pulse-width modulation (PWM) duty cycle at low complexity and system cost. The proposed high-side driver IC with integrated power supply, modulation and demodulation circuits was manufactured in a 180nm high-voltage BiCMOS technology. Measurements confirm the concept of bidirectional signal transmission with a 1MBit/s amplitude modulation, 10/20MHz frequency modulation and a maximum power transmission of 14mW via the transformer.
The power supply is one of the major challenges for applications like internet of things IoTs and smart home. The maintenance issue of batteries and the limited power level of energy harvesting is addressed by the integrated micro power supply presented in this paper. Connected to the 120/230 Vrms mains, which is one of the most reliable energy sources and anywhere indoor available, it provides a 3.3V DC output voltage. The micro power supply consists of a fully integrated ACDC and DCDC converter with one external low voltage SMD buffer capacitor. The micro power supply is fabricated in a low cost 0.35 μm 700 V CMOS technology and covers a die size of 7.7 mm². The use of only one external low voltage SMD capacitor, results in an extremely compact form factor. The ACDC is a direct coupled, full wave rectifier with a subsequent bipolar shunt regulator, which provides an output voltage around 17 V. The DCDC stage is a fully integrated 4:1 SC DCDC converter with an input voltage as high as 17 V and a peak efficiency of 45 %. The power supply achieves an overall output power of 3 mW, resulting in a power density of 390 μW/mm². This exceeds prior art by a factor of 11.
There is a growing need for motor drives with improved EMC in various automotive and industrial applications. An often referenced approach to reduce EME is to change the shape of the switching signal to reduce the EMI caused by the voltage and current transitions. This requires very precise gate control of the power MOSFET to achive better switching behaviour and lower EME without a major increase in switching losses. In order to find an optimal trade-off, this work utilizes a monolithic current mode gate driver with a variable output current that can be changed within 10ns. With this driver, measurements with different gate current profiles were taken. The di/dt transition was confirmed to be as important as the dv/dt transition in the power MOSFET. As a result of the improved switching behavior the emissions were reduced by up to 20dB between 7MHz and 60MHz with a switching loss that is 52% lower than with a constantly low gate current.
The efficiency impact of air-cored inductors used close to and beyond its cut-off frequency in multi-MHz converters is investigated. A method is presented to determine the converter switching frequency that causes the lowest losses in a given inductor. Influential parameters are analysed to optimize an inductor for a predefined switching frequency.
A concept for a slope shaping gate driver IC is proposed, used to establish control over the slew rates of current and voltage during the turn-on and turn off switching transients.
It combines the high speed and linearity of a fully-integrated closed-loop analog gate driver, which is able to perform real-time regulation, with the advantages of digital control, like flexibility and parameter independency, operating in a predictive cycle-bycycle regulation. In this work, the analog gate drive integrated circuit is partitioned into functional blocks and modeled in the small-signal domain, which also includes the non-linearity of parameters. An analytical stability analysis has been performed in order to ensure full functionality of the system controlling a modern generation IGBT and a superjunction MOSFET. Major parameters of influence, such as gate resistor and summing node capacitance, are investigated to achieve stable control. The large-signal behavior, investigated by simulations of a transistor level design, verifies the correct operation of the circuit. Hence, the gate driver can be designed for robust operation.
The increasing slew rate of modern power switches can increase the efficiency and reduce the size of power electronic applications. This requires a fast and robust signal transmission to the gate driver of the high-side switch. This work proposes a galvanically isolated capacitive signal transmission circuit to increase common mode transient immunity (CMTI). An additional signal path is introduced to significantly improve the transmission robustness for small duty cycles to assure a safe turn-off of the power switch. To limit the input voltage range at the comparator on the secondary side during fast high-side transitions, a clamping structure is implemented. A comparison between a conventional and the proposed signal transmission is performed using transistor level simulations. A propagation delay of about 2 ns over a wide range of voltage transients of up to 300V/ns at input voltages up to 600V is achieved.
Bootstrap circuits are mainly used for supplying a gate driver circuit to provide the gate overdrive voltage for a high-side NMOS transistor. The required charge has to be provided by a bootstrap capacitor which is often too large for integration if an acceptable voltage dip at the capacitor has to be guaranteed. Three options of an area efficient bootstrap circuit for a high side driver with an output stage of two NMOS transistors are proposed. The key idea is that the main bootstrap capacitor is supported by a second bootstrap capacitor, which is charged to a higher voltage and connected when the gate driver turns on. A high voltage swing at the second capacitor leads to a high charge allocation. Both bootstrap capacitors require up to 70% less area compared to a conventional bootstrap circuit. This enables compact power management systems with fewer discrete components and smaller die size. A calculation guideline for optimum bootstrap capacitor sizing is given. The circuit was manufactured in a 180nm high-voltage BiCMOS technology as part of a high-voltage gate driver. Measurements confirm the benefit of high-voltage charge storing. The fully integrated bootstrap circuit including two stacked 75.8pF and 18.9pF capacitors results in a voltage dip lower than 1V. This matches well with the theory of the calculation guideline.
Size and cost of a boost converter can be minimized by reducing the voltage overshoot and fastening the transient response in case of load transient. The presented technique improves the transient response of a current mode controlled boost converter, which usually suffers from bandwidth limitation because of its right-half-plane zero (RHPZ). The proposed technique comprises a load current estimation which works as part of a digital controller without any additional measurements. Based on the latest load estimation the controller parameters are adapted, achieving small voltage overshoot and fast transient response. The presented technique was implemented in a digital control circuit, consisting of an ASIC in a 110 nm-technology, a Xilinx Spartan-6 field programmable gate array (FPGA), and a TI-ADS8422 analog to-digital-converter (ADC). Simulation and measurements of a 4V-to-6.3V, 500mA boost converter show an improvement of 50% in voltage overshoot and response time to load transient.
Multilevel-cell (MLC) flash is commonly deployed in today’s high density NAND memories, but low latency and high reliability requirements make it barely used in automotive embedded flash applications. This paper presents a time domain voltage sensing scheme that applies a dynamic voltage ramp at the cells’ control gate (CG) in order to achieve fast and reliable sensing suitable for automotive applications.
A millimeter-wave power amplifier concept in an advanced silicon germanium (SiGe) BiCMOS technology is presented. The goal of the concept is to investigate the impact of physical limitations of the used heterojunction bipolar transistors (HBT) on the performance of a 77 GHz power amplifier. High current behavior, collectorbase breakdown and transistor saturation can be forced with the presented design. The power amplifier is manufactured in an advanced SiGe BiCMOS technology at Infineon Technologies AG with a maximum transit frequency fT of around 250 GHz for npn HBT’s [1]. The simulation results of the power amplifier show a saturated output power of 16 dBm at a power added efficiency of 13%. The test chip is designed for a supply voltage of 3.3 V and requires a chip size of 1.448 x 0.930 mm².
This work presents a fully integrated GaN gate driver in a 180nm HV BCD technology that utilizes high-voltage energy storing (HVES) in an on-chip resonant LC tank, without the need of any external capacitor. It delivers up to 11nC gate charge at a 5V GaN gate, which exceeds prior art by a factor of 45-83, supporting a broad range of GaN transistor types. The stacked LC tank covers an area of only 1.44mm², which corresponds to a superior value of 7.6nC/mm².
Due to their superior fast-switching performance, GaN transistors show enormous potential to enable compact power electronics in applications like renewable energy, electrical cars and home appliances by shrinking down the size of passives. However, fast switching poses challenges for the gate driver. Since GaN transistors have a low threshold voltage Vt of ~1V, an unintended driver turn-on can occur in case of a unipolar gate control as shown for a typical half-bridge in Fig. 24.2.1 (top left). This is due to coupling via the gate-drain capacitance (Miller coupling), when the low-side driver turns on, causing a peak current into the gate. This is usually tackled by applying a negative gate voltage to enhance the safety margin towards Vt, resulting in a bipolar gate-driving scheme. In many power-electronics applications GaN transistors operate in reverse conduction, carrying the inductor current during the dead time t, when the high-side and low-side switch are off (as illustrated at a high-side switch in Fig. 24.2.1, bottom left). As there is no real body diode as in silicon devices, the GaN transistor turns on in reverse operation with a voltage drop VF across the drain-source terminals (quasi-body diode behavior). As a negative gate voltage adds to VF, 63% higher reverse-conduction losses were measured for a typical GaN switch in bipolar gate-drive operation. This drawback is addressed by a three-level gate voltage (positive, 0V, negative), which at the same time provides robustness against unintended turn-on similar to the bipolar gate driver, proven in [1] for a discrete driver.
A wide-bandwidth galvanically isolated current sensing circuit with an integrated Rogowski coil in 180nm CMOS is presented. Exploiting the high-frequency properties of an optimized on-chip Rogowski coil, currents can be measured up to a bandwidth of 75 MHz. The analog sensor front-end comprises a two-stage integrator, which allows a chopper frequency below signal bandwidth, resulting in 2.2 mVrms output noise. An additional integrated Hall sensor extends the measurement range towards DC.