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When a bonding wire becomes too hot, it fuses and fails. The ohmic heat that is generated in the wire can be partially dissipated to a mold package. For this cooling effect the thermal contact between wire and package is an important parameter. Because this parameter can degrade over lifetime, the fusing of a bonding wire can also occur as a long-term effect. Another important factor is the thermal power generated in the vicinity of the bond pads. Nowadays, the reliability of bond wires relies on robust dimensioning based on estimations. Smaller package sizes increase the need for better predictive methods.
The Bond Calculator, a new thermo-electrical simulation tool, is able to predict the temperature profiles along bond wires of arbitrary dimensions in dependence on the applied arbitrary transient current profile, the mold surrounding the wire, and the thermal contact between wire and mold.
In this paper we closely investigated the spatial temperature profiles along different bond wires in air in order to make a first step towards the experimental verification of the simulation model. We are using infrared microscopy in order to measure the thermal radiation generated along the bond wire. This is easier to perform quantitatively in air than in the mold package, because of the non-negligible absorbance of the mold material in the infrared wavelength region.
While digital IC design is highly automated, analog circuits are still handcrafted in a time-consuming, manual fashion today. This paper introduces a novel Parameterized Circuit Description Scheme (PCDS) for the development of procedural analog schematic generators as parameterized circuits. Circuit designers themselves can use PCDS to create circuit automatisms which capture valuable expert knowledge, offer full topological flexibility, and enhance the re-use of well-established topologies. The generic PCDS concept has been successfully implemented and employed to create parameterized circuits for a broad range of use cases. The achieved results demonstrate the efficiency of our PCDS approach and the potential of parameterized circuits to increase automation in circuit design, also to benefit physical design by promoting the common schematic-driven-layout flow, and to enhance the applicability of circuit synthesis approaches.
Nowadays, the demand for a MEMS development/design kit (MDK) is even more in focus than ever before. In order to achieve a high quality and cost effectiveness in the development process for automotive and consumer applications, an advanced design flow for the MEMS (micro electro mechanical systems) element is urgently required. In this paper, such a development methodology and flow for parasitic extraction of active semiconductor devices is presented. The methodology considers geometrical extraction and links the electrically active pn junctions to SPICE standard library models and subsequently extracts the netlist. An example for a typical pressure sensor is presented and discussed. Finally, the results of the parasitic extraction are compared with fabricated devices in terms of accuracy and capability.
The hotspot detection has received much attention in the recent years due to a substantial mismatch between lithography wavelength and semiconductor technology feature size. This mismatch causes diffraction when transferring the layout from design onto a silicon wafer. As a result, open or short circuits (i.e. lithography hotspots) are more likely to be produced. Additionally, increasing numbers of semiconductors devices on a wafer required more time for the lithography hotspot detection analysis. In this work, we propose a fast and accurate solution based on novel artificial neural network (ANN) architecture for precise lithography hotspot detection using a convolution neural network (CNN) adopting a state of-the-art technique. The experimental results showed that the proposed model gained accuracy improvement over current state-of-theart approaches. The final code has been made publicly available.
Equations for fast and exact calculation of a simple model for heat transfer from a bond wire to a cylindrical finite mold package including nonideal heat transfer from wire to mold are presented. These allow for a characterization of an arbitrary mold/bond wire combination. The real mold geometry is approximated using the mold model cylinder radius and the thermal contact conductance of the mold/bond wire interface. For changes in bond and mold material, wire length, diameter, and current transient profiles, the resulting temperature transients can then be predicted. As the method is based on numerical integration of differential equations, arbitrary pulse shapes, which are industrially relevant, can be calculated. Very high thermal contact conductance values (above 40 000 W/m2K heat transfer) have been detected in real package/bond systems. The method was validated by successful comparison with finite element method simulations and alternative calculation methods and measurements.
Optimization-based design automation for analog ICs still remains behind the demands. A promising alternative is given by procedural approaches such as parameterized generators, also known as PCells. We are working on a complete analog design flow based on parameterized generators for entire circuits and corresponding layout modules. Because the conventional programming of such enhanced generators is far too complicated and costly, new methods are needed to ease their development. This paper presents gPCDS (graphical PCDS), a novel tool for a designer-oriented development of schematic module generators, integrated into a common schematic entry environment. The tool is based on PCDS (Parameterized Circuit Description Scheme), a meta-language for the creation of parametrized analog circuits. Schematic module generators are a very desirable complement to layout module generators in order to achieve a seamless schematic- driven layout design flow on module level. By facilitating a way of generator development that matches a design expert’s mentality, gPCDS contributes to close this gap in the analog design flow.
Due to the lack of sophisticated component libraries for microelectromechanical systems (MEMS), highly optimized MEMS sensors are currently designed using a polygon driven design flow. The advantage of this design flow is its accurate mechanical simulation, but it lacks a method for an efficient and accurate electrostatic analysis of parasitic effects of MEMS. In order to close this gap in the polygon-driven design flow, we present a customized electrostatic analysis flow for such MEMS devices. Our flow features a 2.5D fabrication-process simulation, which simulates the three typical MEMS fabrication steps (namely deposition of materials including topography, deep reactive-ion etching, and the release etch by vapor-phase etching) very fast and on an acceptable abstraction level. Our new 2.5D fabrication-process simulation can be combined with commercial field-solvers such as they are commonly used in the design of integrated circuits. The new process simulation enables a faster but nevertheless satisfactory analysis of the electrostatic parasitic effects, and hence simplifies the electrical optimization of MEMS.
Layout generators, commonly denoted as PCells (parameterized cells), play an important role in the layout design of analog ICs (integrated circuits). PCells can automatically create parts of a layout, whose properties are controlled by the PCell parameters. Any layout, whether hand-crafted or automatically generated, has to be verified against design rules using a DRC (design rule check) in order to assure proper functionality and producibility. Due to the growing complexity of today’s PCells it would be beneficial if a PCell itself could be ensured to produce DRC clean layouts for any allowed parameter values, i.e. a formal verification of the PCell’s code rather than checking all possible instances of the PCell. In this paper we demonstrate the feasibility of such a formal PCell verification for a simple NMOS transistor PCell. The set from which the parameter values can be chosen was found during the verification process.
This paper presents a toolbox in Matlab/Octave for procedural design of analog integrated circuits. The toolbox contains all native functions required by analog designers (namely, schematic-generation, simulation setup and execution, integrated look-up tables and functions for design space exploration) to capture an entire design strategy in an executable script. This script - which we call an Expert Design Plan (EDP) - is capable of executing an analog circuit design fully automatically. The toolbox is integrated in an existing design flow. A bandgap reference voltage circuit is designed with this tool in less than 15 min.
Analog integrated circuit sizing still relies heavily on human expert knowledge as previous automation approaches have not found wide-spread acceptance in industry. One strand, the optimization-based automation, is often discarded due to inflated constraining setups, infeasible results or excessive run times. To address these deficits, this work proposes a alternative optimization flow featuring a designer’s intuition for feasible design spaces through integration of expert knowledge based on the gm/ID-method. Moreover, the extensive run times of simulation-based optimization flows are overcome by incorporating computationally efficient machine learning methods. Neural network surrogate models predicting eleven performance parameters increase the evaluation speed by 3 400× on average compared to a simulator. Additionally, they enable the use of optimization algorithms dependent on automatic differentiation, that would otherwise be unavailable in this field. First, an up to 4× more efficient way for sampling training data based on the aforementioned space is detailed. After presenting the architecture and training effort regarding the surrogate models, they are employed as part of the objective function for sizing three operational amplifiers with three different optimization algorithms. Additionally, the benefits of using the gm/ID-method become evident when considering technology migration, as previously found solutions may be reused for other technologies.
This paper enhances SWARM, a novel deterministic analog layout automation approach based on the idea of cellular automata. SWARM implements a decentralized interaction model in which responsive layout modules, covering basic circuit types, autonomously move, rotate and deform themselves to let constraint-compliant, compact layout solutions emerge from a synergetic flow of self-organization. With the ability to consider design constraints both implicitly and explicitly, SWARM joins the layout quality of procedural generators with the flexibility of optimization algorithms, combining these two kinds of automation into a “bottom-up meets top-down” flow. The new enhancements are demonstrated in an OTA example, depicting the power of SWARM and its enormous potential for future developments.
In analog layout design, chip floorplans are usually still handcrafted by human experts. Particularly, the nondiscrete variability of block dimensions must be exploited thereby, which is a serious challenge for optimization-based algorithmic floorplanners. This paper presents a fundamentally new automation approach based on self-organization, in which floorplan blocks can autonomously move, rotate and deform themselves to jointly let compact results emerge from a synergistic flow of interaction. Our approach is able to minimize area and wirelength, supports nonslicing floorplan structures, can consider fully variable block dimensions, accounts for a fixed rectilinear boundary, and works absolutely deterministic. The approach is innovatively different from conventional, top-down oriented floorplanning algorithms.
In contrast to IC design, MEMS design still lacks sophisticated component libraries. Therefore, the physical design of MEMS sensors is mostly done by simply drawing polygons. Hence, the sensor structure is only given as plain graphic data which hinders the identification and investigation of topology elements such as spring, anchor, mass and electrodes. In order to solve this problem, we present a rule-based recognition algorithm which identifies the architecture and the topology elements of a MEMS sensor. In addition to graphic data, the algorithm makes use of only a few marking layers, as well as net and technology information. Our approach enables RC-extraction with commercial field solvers and a subsequent synthesis of the sensor circuit. The mapping of the extracted RC-values to the topology elements of the sensor enables a detailed analysis and optimization of actual MEMS sensors.
This paper introduces a novel placement methodology for a common-centroid (CC) pattern generator. It can be applied to various integrated circuit (IC) elements, such as transistors, capacitors, diodes, and resistors. The proposed method consists of a constructive algorithm which generates an initial, close to the optimum, solution, and an iterative algorithm which is used subsequently, if the output of constructive algorithm does not satisfy the desired criteria. The outcome of this work is an automatic CC placement algorithm for IC element arrays. Additionally, the paper presents a method for the CC arrangement evaluation. It allows for evaluating the quality of an array, and a comparison of different placement methods.
A new method for the analysis of movement dependent parasitics in full custom designed MEMS sensors
(2017)
Due to the lack of sophisticated microelectromechanical systems (MEMS) component libraries, highly optimized MEMS sensors are currently designed using a polygon driven design flow. The strength of this design flow is the accurate mechanical simulation of the polygons by finite element (FE) modal analysis. The result of the FE-modal analysis is included in the system model together with the data of the (mechanical) static electrostatic analysis. However, the system model lacks the dynamic parasitic electrostatic effects, arising from the electric coupling between the wiring and the moving structures. In order to include these effects in the system model, we present a method which enables the quasi dynamic parasitic extraction with respect to in-plane movements of the sensor structures. The method is embedded in the polygon driven MEMS design flow using standard EDA tools. In order to take the influences of the fabrication process into account, such as etching process variations, the method combines the FE-modal analysis and the fabrication process simulation data. This enables the analysis of dynamic changing electrostatic parasitic effects with respect to movements of the mechanical structures. Additionally, the result can be included into the system model allowing the simulation of positive feedback of the electrostatic parasitic effects to the mechanical structures.
We present a new methodology for automatic selection and sizing of analog circuits demonstrated on the OTA circuit class. The methodology consists of two steps: a generic topology selection method supported by a “part-sizing” process and subsequent final sizing. The circuit topologies provided by a reuse library are classified in a topology tree. The appropriate topology is selected by traversing the topology tree starting at the root node. The decision at each node is gained from the result of the part-sizing, which is in fact a node-specific set of simulations. The final sizing is a simulation-based optimization. We significantly reduce the overall simulation effort compared to a classical simulation-based optimization by combining the topology selection with the part-sizing process in the selection loop. The result is an interactive user friendly system, which eases the analog designer’s work significantly when compared to typical industrial practice in analog circuit design. The topology selection method and sizing process are implemented as a tool into a typical analog design environment. The design productivity improvement achievable by our method is shown by a comparison to other design automation approaches.
A generic, knowledge-based method for automatic topology selection of analog circuits in a predefined analog reuse library is presented in this paper on the OTA (Operational Transconductance Amplifier) example. Analog circuits of a given circuit class are classified in a topology tree, where each node represents a specific topology. Child nodes evolve from their parent nodes by an enhancement of the parent node’s topological structure. Topology selection is performed by a depth first-search in the topology tree starting at the root node, thus checking topologies of increasing complexity. The decisions at each node are based on solving equations or – if this is not possible – on simulations. The search ends at the first (and thus the simplest) topology which can meet the specification after an adequate circuit sizing. The advantages of the generic, tree based topology selection method presented in this paper are shown in comparison to a pool selection method and to heuristic approaches. The selection is based on an accomplished chip investigation.
In this paper, we address the novel EDP (Expert Design Plan) principle for procedural design automation of analog integrated circuits, which captures the knowledge-based design strategy of human circuit designers in an executable script, making it reusable. We present the EDP Player, which enables the creation and execution of EDPs for arbitrary circuits in the Cadence® Virtuoso® Design Environment. The tool provides a generic version of an instruction set, called EDPL (EDPLanguage), enabling emulation of a typical manual analog sizing flow. To automate the design of a Miller Operational Amplifier and to create variants of a Smart Power IC, several EDPs were implemented using this tool. Employing these EDPs leads to a strong reduction of design time without compromising design quality or reliability.