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A fully passive RFID temperature sensor SoC with an accuracy of ±0.4 ◦C (3σ) from 0 ◦C to 125 ◦C
(2019)
This paper presents a fully passive 13.56 -MHz RFID temperature sensor system-on-chip. Its power management unit operates over a large temperature range using a zero temperature coefficient bias source. On-chip temperature sensing is accomplished with low-voltage, low-power CMOS circuitry, and time-domain signal processing. Two readout commands have been defined to study supply noise sensitivity: 1) standard readout, where just a single set of data is transferred to the reader and 2) serial readout, where several sets of data are sent one after the other to the reader. With the standard readout command, the sensor suffers from interference from the RFID command packet and outputs interference as well, while the sensor outputs no interference with the serial readout command. Measurements show that sensor resolution with serial readout is improved by a factor of approximately 16 compared to standard readout. The chip was fabricated in a standard 0.35-μm CMOS technology and chip-on-board mounted to a tuned RFID transponder coil on an aluminum core FR4 PCB substrate. Real time wireless temperature sensing has been demonstrated with a commercial HF RFID reader. With a two-point calibration, the SoC achieves a 3σ sensing accuracy of ±0.4 ◦C from 0◦C to 125 ◦C.
In this paper, we address the novel EDP (Expert Design Plan) principle for procedural design automation of analog integrated circuits, which captures the knowledge-based design strategy of human circuit designers in an executable script, making it reusable. We present the EDP Player, which enables the creation and execution of EDPs for arbitrary circuits in the Cadence® Virtuoso® Design Environment. The tool provides a generic version of an instruction set, called EDPL (EDPLanguage), enabling emulation of a typical manual analog sizing flow. To automate the design of a Miller Operational Amplifier and to create variants of a Smart Power IC, several EDPs were implemented using this tool. Employing these EDPs leads to a strong reduction of design time without compromising design quality or reliability.
Rapidly growing population and increasing amount of shipments induced by the e-commerce are two of the main reasons for the constantly rising urban freight traffic. Cities are therefore overwhelmed by a growing stream of goods and the available infrastructure, shared between people and goods traffic, often reached its maximum capacity. Phenomena such as traffic congestion, pollution and lack of space are direct consequences of this trend and their impact on the quality of life in the city is not negligible. City administrations are keen to evaluate innovative city logistics concepts and adopt alternative solutions, to overcome the challenges posed by such a dynamic environment, constrained in existing infrastructure. In this paper, a heuristic method based on the utility analysis is presented. Thanks to a modular approach accounting for stakeholders´ requirements, possible different scenarios and available technologies, the development of new city logistic concepts is supported. The proposed method is then applied to a case study concerning the city of Reutlingen (Germany). Results are presented and a brief discussion leads to the conclusion.
This paper presents an approach for the implementation of a modular and scalable power electronics device for controlling electric drives in the field of electric vehicles using wide bandgap semiconductor devices. The main idea is to achieve the required output currents or voltages by connecting adequately designed hardware modules in parallel or in series. This particular design is based on the fact that the single modules generate a continuous and specified output voltage from a given dc voltage, e.g. an intermediate circuit or battery voltage. The main benefit is, that different current or voltage requirements can be satisfied based on a single module thus decreasing development and production costs. The current paper focuses on the connection in parallel of such modules. A control architecture is illustrated and a first proof of concept is given.
A novel brushless excitation concept for synchronous machines with a rotating power converter is proposed in this paper. The concept does not need an auxiliary winding or any other modification to the machine structure apart from an inverter with a DC link capacitor and a controller on the rotor. The power required for the rotor excitation is provided by injecting harmonics into the stator winding. Thus, a voltage in the field coil is induced. The rotor inverter is controlled such that the alternating current charges the DC link capacitor. At the same time the inverter supplies the DC field current to the field coil. The excitation concept is first developed in theory, then presented using an analytical model and FEA, and lastly investigated with a prelimininary experimental setup.
While Microservices promise several beneficial characteristics for sustainable long-term software evolution, little empirical research covers what concrete activities industry applies for the evolvability assurance of Microservices and how technical debt is handled in such systems. Since insights into the current state of practice are very important for researchers, we performed a qualitative interview study to explore applied evolvability assurance processes, the usage of tools, metrics, and patterns, as well as participants’ reflections on the topic. In 17 semi-structured interviews, we discussed 14 different Microservice-based systems with software professionals from 10 companies and how the sustainable evolution of these systems was ensured. Interview transcripts were analyzed with a detailed coding system and the constant comparison method.
We found that especially systems for external customers relied on central governance for the assurance. Participants saw guidelines like architectural principles as important to ensure a base consistency for evolvability. Interviewees also valued manual activities like code review, even though automation and tool support was described as very important. Source code quality was the primary target for the usage of tools and metrics. Despite most reported issues being related to Architectural Technical Debt (ATD), our participants did not apply any architectural or service-oriented tools and metrics. While participants generally saw their Microservices as evolvable, service cutting and finding an appropriate service granularity with low coupling and high cohesion were reported as challenging. Future Microservices research in the areas of evolution and technical debt should take these findings and industry sentiments into account.
Due to frequently changing requirements, the internal structure of cloud services is highly dynamic. To ensure flexibility, adaptability, and maintainability for dynamically evolving services, modular software development has become the dominating paradigm. By following this approach, services can be rapidly constructed by composing existing, newly developed and publicly available third-party modules. However, newly added modules might be unstable, resource-intensive, or untrustworthy. Thus, satisfying non-functional requirements such as reliability, efficiency, and security while ensuring rapid release cycles is a challenging task. In this paper, we discuss how to tackle these issues by employing container virtualization to isolate modules from each other according to a specification of isolation constraints. We satisfy non-functional requirements for cloud services by automatically transforming the modules comprised into a container-based system. To deal with the increased overhead that is caused by isolating modules from each other, we calculate the minimum set of containers required to satisfy the isolation constraints specified. Moreover, we present and report on a prototypical transformation pipeline that automatically transforms cloud services developed based on the Java Platform Module System into container-based systems.
In this work design rules for a novel brushless excitation system for externally excited synchronous machines are discussed. The concept replaces slip rings with a fullbridge active rectifier and a controller mounted on the rotor. An AC signal induced from the stator is used to charge the rotor DC link. The DC current for the rotor excitation is provided from this DC link source. Finite element analysis of an existing machine is used to analyze the practicability of the excitation system.
The complexity of supply chains increases, especially due to the geographical spread of supplier and customer networks. In the connected and automated supply chains of the industry 4.0, even more nodes are incorporated in supply chains. This paper discusses the possible improvement of process quality in the industry 4.0 through the different blockchain and distributed ledger technologies. We derived hypotheses from a literature review and asked German blockchain experts from the industry to validate and discuss the hypotheses. We find that the different blockchain technologies and consensus algorithms have different strength with regard to quality improvement. One central finding is that IOTA, developed especially for the IoT and deemed the ’next evolutionary step’ is scalable and hence may increase the process efficiency, but at the same time is more vulnerable than other blockchain implementations, which again may reduce the overall process quality.
Due to the lack of sophisticated component libraries for microelectromechanical systems (MEMS), highly optimized MEMS sensors are currently designed using a polygon driven design flow. The advantage of this design flow is its accurate mechanical simulation, but it lacks a method for an efficient and accurate electrostatic analysis of parasitic effects of MEMS. In order to close this gap in the polygon-driven design flow, we present a customized electrostatic analysis flow for such MEMS devices. Our flow features a 2.5D fabrication-process simulation, which simulates the three typical MEMS fabrication steps (namely deposition of materials including topography, deep reactive-ion etching, and the release etch by vapor-phase etching) very fast and on an acceptable abstraction level. Our new 2.5D fabrication-process simulation can be combined with commercial field-solvers such as they are commonly used in the design of integrated circuits. The new process simulation enables a faster but nevertheless satisfactory analysis of the electrostatic parasitic effects, and hence simplifies the electrical optimization of MEMS.