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We discuss the fabrication technologies for IC chips in this chapter. We will focus on the main process steps and especially on those aspects that are of particular importance for understanding how they affect, and in some cases drive, the layout of ICs. All our analyses in this chapter will be for silicon as the base material; the principles and understanding gained can be applied to other substrates as well. Following a brief introduction to the fundamentals of IC fabrication (Sect. 2.1) and the base material used in it, namely silicon (Sect. 2.2), we discuss the photolithography process deployed for all structuring work in Sect. 2.3. We will then present in Sect. 2.4 some theoretical opening remarks on typical phenomena encountered in IC fabrication. Knowledge of these phenomena is very useful for understanding the process steps we cover in Sects. 2.5–2.8. We examine a simple exemplar process in Sect. 2.9 and observe how a field-effect transistor (FET) – the most important device in modern integrated circuits—is created. To drive the key points home, we provide a review of each topic at the end of every section from the point of view of layout design by discussing relevant physical design aspects.
Investigation of tympanic membrane influences on middle-ear impedance measurements and simulations
(2020)
This study simulates acoustic impedance measurements in the human ear canal and investigates error influences due to improperly accounted evanescence in the probe’s near field, cross-section area changes, curvature of the ear canal, and pressure inhomogeneities across the tympanic membrane, which arise mainly at frequencies above 10 kHz. Evanescence results from strongly damped modes of higher order, which can only be found in the near field of the sound source and are excited due to sharp cross-sectional changes as they occur at the transition from the probe loudspeaker to the ear canal. This means that different impedances are measured depending on the probe design. The influence of evanescence cannot be eliminated completely from measurements, however, it can be reduced by a probe design with larger distance between speaker and microphone. A completely different approach to account for the influence of evanescence is to evaluate impedance measurements with the help of a finite element model, which takes the precise arrangement of microphone and speaker in the measurement into account. The latter is shown in this study exemplary on impedance measurements at a tube terminated with a steel plate. Furthermore, the influences of shape changes of the tympanic membrane and ear canal curvature on impedance are investigated.
This book covers the fundamental knowledge of layout design from the ground up, addressing both physical design, as generally applied to digital circuits, and analog layout. Such knowledge provides the critical awareness and insights a layout designer must possess to convert a structural description produced during circuit design into the physical layout used for IC/PCB fabrication.