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This paper presents a digitally controlled boost converter IC for high output voltage and fast transient applications. Thus, it is well applicable in automotive and industrial environments. The 3V-to-6V input voltage, 6.3V output voltage, 1A boost converter IC is fabricated in a 180nm BCD technology. Digital control enables cost savings, advanced control concepts, and it is less parameter sensitive compared to common analog control. A 90 ns latency, 6-bit delay line ADC operates with a window concept, meeting high resolution requirements, e.g. in car battery applications. An output voltage live tracking is included for extending the ADC conversion window. A charge pump DAC provides high resolution, monotonicity, and short 128 ns conversion time. Further, a standard digital PI controller is enhanced by a simple but effective ΔV/Δt-intervention control. It results in 2.8x reduced output voltage deviations in case of load steps, scaling down the output capacitor value by the same factor.
Boost converters suffer from a bandwidth limitation caused by the right-half plane zero (RHPZ), which occurs in the control-to-output transfer function. In contrast, there are many applications that require superior dynamic behavior. Further, size and cost of boost converter systems can be minimized by reduced voltage deviations and fast transient responses in case of large signal load transients. The key idea of the proposed ΔV/Δt-intervention control concept is to adapt the controller output to its new steady state value immediately after a load transient by prediction from known parameters. The concept is implemented in a digital control circuit, consisting of an ASIC in a 110 nm-technology and a Xilinx Spartan-6 field programmable gate array (FPGA). In a boost converter with 3.5V input voltage, 6.3V output voltage, 1.2A load, and 500 kHz switching frequency, the output voltage deviations are 2.8x smaller, scaling down the output capacitor value by the same factor. The recovery times are 2.4x shorter in case of large signal load transients with the proposed concept. The control is widely applicable, as it supports constant switching frequencies and allows for duty cycle and inductor current limitations. It also shows various advantages compared to conventional control and to selected adaptive control concepts.
This paper presents a wide-Vin step-down parallel-resonant converter (PRC), comprising an integrated 5-bit capacitor array and a 300-nH resonant coil, placed in parallel to a conventional buck converter. Soft-switching resonant converters are beneficial for high-Vin multi-MHz converters to reduce dominant switching losses, enabling higher switching frequencies. The output filter inductor is optimized based on an empirical study of available inductors. The study shows that faster switching significantly reduces not only the inductor value but also volume, price, and even the inductor losses. In addition, unlike conventional resonant concepts, soft-switching control as part of the proposed PRC eliminates input voltage-dependent losses over a wide operating range, resulting in 76.3% peak efficiency. At Vin = 48 V, a loss reduction of 35% is achieved compared with the conventional buck converter. Adjusting an integrated capacitor array, and selecting the number of oscillation periods, keeps the switching frequency within a narrow range. This ensures high efficiency across a wide range of Vin = 12–48 V, 100–500-mA load, and 5-V output at up to 25-MHz switching frequency. Thanks to the low output current ripple, the output capacitor can be as small
as 50 nF.
This paper presents a dc–dc converter for integration in the power management unit of an ultra-low power microcontroller. The converter is designed to significantly reduce the wake-up energy and startup delay of the supplied core. The use of a minimized output capacitor is the key factor to save the wake-up energy. The converter is buffered with only 56 nF and guarantees a stable output of 1.2 V with a voltage ripple smaller than 30 mV. The controller of the proposed dc–dc converter is based on a predictive peak current control that allows the system to control the energy transfer at extremely low power consumption. The proposed circuit is implemented in 130 nm CMOS technology with an area of only 0.14 mm². It achieves a high conversion efficiency of 92.1% and a small quiescent current of 440 nA. It operates from 1.8 to 3.3 V with a maximum load of 2.65 mA.
The level shifter and the floating gate supply for high-side transistors are a major challenge in high-voltage DCDC converters. This paper presents a high speed and power-efficient level shifter for voltages of up to 50V, suitable for both PMOS and NMOS power FETs. A switching node falling edge detection allows both, a sensitive and safe signal detection. This enables a robust operation during steep dv / dt transitions and a power consumption as low as 4.1 pJ per switching cycle, which is a reduction of more than 40% compared to prior art. An active clamping circuit prevents common mode displacement currents into the high-side supply. The level shifter is implemented in a 180nm BiCMOS technology. Measurements confirm a 50V 120MHz high-speed operation of the level shifter with a rising / falling propagation delay of 1.45 ns / 1.3 ns, respectively. The dv / dt robustness has been confirmed by measurements for transitions up to 6V/ ns.
A wide-bandwidth galvanically isolated current sensing circuit with an integrated Rogowski coil in 180nm CMOS is presented. Exploiting the high-frequency properties of an optimized on-chip Rogowski coil, currents can be measured up to a bandwidth of 75 MHz. The analog sensor front-end comprises a two-stage integrator, which allows a chopper frequency below signal bandwidth, resulting in 2.2 mVrms output noise. An additional integrated Hall sensor extends the measurement range towards DC.
Due to their superior fast-switching performance, GaN transistors show enormous potential to enable compact power electronics in applications like renewable energy, electrical cars and home appliances by shrinking down the size of passives. However, fast switching poses challenges for the gate driver. Since GaN transistors have a low threshold voltage Vt of ~1V, an unintended driver turn-on can occur in case of a unipolar gate control as shown for a typical half-bridge in Fig. 24.2.1 (top left). This is due to coupling via the gate-drain capacitance (Miller coupling), when the low-side driver turns on, causing a peak current into the gate. This is usually tackled by applying a negative gate voltage to enhance the safety margin towards Vt, resulting in a bipolar gate-driving scheme. In many power-electronics applications GaN transistors operate in reverse conduction, carrying the inductor current during the dead time t, when the high-side and low-side switch are off (as illustrated at a high-side switch in Fig. 24.2.1, bottom left). As there is no real body diode as in silicon devices, the GaN transistor turns on in reverse operation with a voltage drop VF across the drain-source terminals (quasi-body diode behavior). As a negative gate voltage adds to VF, 63% higher reverse-conduction losses were measured for a typical GaN switch in bipolar gate-drive operation. This drawback is addressed by a three-level gate voltage (positive, 0V, negative), which at the same time provides robustness against unintended turn-on similar to the bipolar gate driver, proven in [1] for a discrete driver.
This paper presents a fully integrated gate driver in a 180-nm bipolar CMOS DMOS (BCD) technology with 1.5-A max. gate current, suitable for normally OFF gallium nitride (GaN) power switches, including gate-injection transistors (GIT). Full-bridge driver architecture provides a bipolar and three-level gate drive voltage for a robust and efficient GaN switching. The concept of high voltage energy storing (HVES), which comprises an on-chip resonant LC tank, enables a very area-efficient buffer capacitor integration and superior gatedriving speed. It reduces the component count and the influence of parasitic gate-loop inductance. Theory and calculations confirm the benefits of HVES compared to other capacitor implementation methods. The proposed gate driver delivers a gate charge of up to 11.6 nC, sufficient to drive most types of currently available GaN power transistors. Consequently, HVES enables to utilize the fast switching capabilities of GaN for advanced and compact power electronics.
The maintenance issue of batteries and the limited power level of energy harvesting is addressed by the presented integrated micropower supply. Connected to the 120/230-VRMS mains, it provides a 3.3-V ac output voltage, suitable for applications such as the Internet-of Things and smart homes. The micropower supply consists of a fully integrated ac–dc and dc–dc converter with one external low-voltage surface mount device buffer capacitor, resulting in an extremely compact size. Fabricated in a low-cost 0.35-μm 700-V complimentary metal-oxide-semiconductor technology, it covers a die size of 7.7 mm². The ac–dc converter is a direct coupled, full-wave rectifier with a subsequent series regulator. The dc–dc stage is a fully integrated capacitive 4:1 converter with up to 17-V input and 47.4% peak efficiency. The power supply comprises several high-voltage control circuits including level shifters and various types of charge pumps (CPs). A source supplied CP is utilized that supports a varying switching node potential. The overall losses are discussed and optimized, including flying capacitor bottom-plate losses. The power supply achieves an output power of 3 mW, resulting in a power density of 390 μW/mm². This exceeds prior art by a factor of 11.
The presented wide-Vin step-down converter introduces a parallel-resonant converter (PRC), comprising an integrated 5-bit capacitor array and a 300 nH resonant coil, placed in parallel to a conventional buck converter. Unlike conventional resonant concepts, the implemented soft-switching control eliminates input voltage dependent losses over a wide operating range. This ensures high efficiency across a wide range of Vin= 12-48V, 100-500mA load and 5V output at up to 15MHz switching frequency. The peak efficiency of the converter is 76.3 %. Thanks to the low output current ripple, the output capacitor can be as small as 50 nF, while the inductor tolerates a larger ESR, resulting in small component size. The proposed PRC architecture is also suitable for future power electronics applications using fast-switching GaN devices.
More and more power electronics applications utilize GaN transistors as they enable higher switching frequencies in comparison to conventional Si devices. Faster switching shrinks down the size of passives and enables compact solutions in applications like renewable energy, electrical cars and home appliances. GaN transistors benefit from ~10× smaller gate charge QG and gate drive voltages in the range of typically 5V vs. ~15V for Si.
Modern power transistors are able to switch at very high transition speed, which can cause EMC violations and overshoot. This is addressed by a gate driver with variable gate current, which is able to control the transition speed. The key idea is that the gate driver can influence the di/dt and dv/dt transition separately and optimize whichever transition promises the highest improvement while keeping switching losses low. To account for changes in the load current, supply voltage, etc., a control loop is required in the driver to ensure optimized switching. In this paper, an efficient control scheme for an automotive gate driver with variable output current capability is presented. The effectiveness of the control loop is demonstrated for a MOSFET bridge consisting of OptiMOS-T2™devices with a total gate charge of 39nC. This bridge setup shows dv/dt transitions between 50 to 1000ns, depending on driving current. The driver is able to switch between gate current levels of 1 to 500mA in 10/15ns (rising/falling transition). With the implemented control loop the driver is measured to significantly reduce the ringing and thereby reduce device stress and electromagnetic emissions while keeping switching losses 52% lower than with a constant current driver.
A concept for a slope shaping gate driver IC is proposed, used to establish control over the slew rates of current and voltage during the turn-on and turn off switching transients.
It combines the high speed and linearity of a fully-integrated closed-loop analog gate driver, which is able to perform real-time regulation, with the advantages of digital control, like flexibility and parameter independency, operating in a predictive cycle-bycycle regulation. In this work, the analog gate drive integrated circuit is partitioned into functional blocks and modeled in the small-signal domain, which also includes the non-linearity of parameters. An analytical stability analysis has been performed in order to ensure full functionality of the system controlling a modern generation IGBT and a superjunction MOSFET. Major parameters of influence, such as gate resistor and summing node capacitance, are investigated to achieve stable control. The large-signal behavior, investigated by simulations of a transistor level design, verifies the correct operation of the circuit. Hence, the gate driver can be designed for robust operation.
In a digitally controlled slope shaping system, reliable detection of both voltage and current slope is required to enable a closed-loop control for various power switches independent of system parameters. In most state-of-the-art works, this is realized by monitoring the absolute voltage and current values. Better accuracy at lower DC power loss is achieved by sensing techniques for a reliable passive detection, which is achieved through avoiding DC paths from the high voltage network into the sensing network. Using a high-speed analog-to-digital converter, the whole waveform of the transient derivative can be stored digitally and prepared for a predictive cycle-by-cycle regulation, without requiring high-precision digital differentiation algorithms. To gain an accurate representation of the voltage and current derivative waveforms, system parasitics are investigated and classified in three sections: (1) component parasitics, which are identified by s-parameter measurements and extraction of equivalent circuit models, (2) PCB design issues related to the sensing circuit, and (3) interconnections between adjacent boards.
The contribution of this paper is an optimized sensing network on the basis of the experimental study supporting fast transition slopes up to 100 V/ns and 1 A/ns and beyond, making the sensing technique attractive for slope shaping of fast switching devices like modern generation IGBTs, CoolMOSTM and SiC mosfets. Measurements of the optimized dv/dt and di/dt setups are demonstrated for a hard switched IGBT power stage.
An integrated synchronous buck converter with a high resolution dead time control for input voltages up to 48V and 10MHz switching frequency is presented. The benefit of an enhanced dead time control at light loads to enable zero voltage switching at both the high-side and low-side switch at low output load is studied. This way, compact multi-MHz DCDC converters can be implemented at high efficiency over a wide load current range. The concept also eliminates body diode forward conduction losses and minimizes reverse recovery losses. A dead time resolution of 125 ps is realized by an 8-bit differential delay chain. A further efficiency enhancement by soft switching at the high-side switch at light load is achieved with a voltage boost of the switching node by dead time control in forced continuous conduction mode. The monolithic converter is implemented in an 180nm high-voltage BiCMOS technology. At V IN = 48V, V OUT = 5V, 50mA load, 10MHz switching frequency and 500 nH output inductance, the efficiency is measured to be increased by 14.4% compared to a conventional predictive dead time control. A peak efficiency of 80.9% is achieved at 12V input.
In recent years, significant progress has been made on switched-capacitor DC-DC converters as they enable fully integrated on-chip power management. New converter topologies overcame the fixed input-to-output voltage limitation and achieved high efficiency at high power densities. SC converters are attractive to not only mobile handheld devices with small input and output voltages, but also for power conversion in IoE, industrial and automotive applications, etc. Such applications need to be capable of handling widely varying input voltages of more than 10V, which requires a large amount of conversion ratios. The goal is to achieve a fine granularity with the least number of flying capacitors. In [1] an SC converter was introduced that achieves these goals at low input voltage VIN ≤ 2.5V. [2] shows good efficiency up to VIN = 8V while its conversion ratio is restricted to ≤1/2 with a limited, non-equidistant number of conversion steps. A particular challenge arises with increasing input voltage as several loss mechanisms like parasitic bottom-plate losses and gate-charge losses of high-voltage transistors become of significant influence. High input voltages require supporting circuits like level shifters, auxiliary supply rails etc., which allocate additional area and add losses [2-5]. The combination of both increasing voltage and conversion ratios (VCR) lowers the efficiency and the achievable output power of SC converters. [3] and [5] use external capacitors to enable higher output power, especially for higher VIN. However, this is contradictory to the goal of a fully integrated power supply.
A highly integrated synchronous buck converter with a predictive dead time control for input voltages >18 V with 10 MHz switching frequency is presented. A high resolution dead time of ˜125 ps allows to reduce dead time dependent losses without requiring body diode conduction to evaluate the dead time. High resolution is achieved by frequency compensated sampling of the switching node and by an 8 bit differential delay chain. Dead time parameters are derived in a comprehensive study of dead time depended losses. This way, the efficiency of fast switching DC-DC converters can be optimized by eliminating the body diode forward conduction losses, minimizing reverse recovery losses and by achieving zero voltage switching. High-speed circuit blocks for fast switching operation are presented including level shifter, gate driver, PWM generator. The converter has been implemented in a 180 nm high-voltage BiCMOS technology.
The power supply is one of the major challenges for applications like internet of things IoTs and smart home. The maintenance issue of batteries and the limited power level of energy harvesting is addressed by the integrated micro power supply presented in this paper. Connected to the 120/230 Vrms mains, which is one of the most reliable energy sources and anywhere indoor available, it provides a 3.3V DC output voltage. The micro power supply consists of a fully integrated ACDC and DCDC converter with one external low voltage SMD buffer capacitor. The micro power supply is fabricated in a low cost 0.35 μm 700 V CMOS technology and covers a die size of 7.7 mm². The use of only one external low voltage SMD capacitor, results in an extremely compact form factor. The ACDC is a direct coupled, full wave rectifier with a subsequent bipolar shunt regulator, which provides an output voltage around 17 V. The DCDC stage is a fully integrated 4:1 SC DCDC converter with an input voltage as high as 17 V and a peak efficiency of 45 %. The power supply achieves an overall output power of 3 mW, resulting in a power density of 390 μW/mm². This exceeds prior art by a factor of 11.
A high-voltage replica based current sensor is presented, along with challenges and design techniques which are rarely discussed in literature so far. The performance is evaluated by detailed small signal and large signal analysis. By dedicated placing of high-voltage cascode devices, while keeping as many low-voltage devices as possible, a high gain-bandwidth product is achieved. A decoupling and biasing circuit is introduced which improves the response time of the current sensor at on/off transitions by a factor of five. The current sensor is implemented in a 180nm HV BiCMOS technology. The sensor achieves a DC loop gain of 83 dB and a gain-bandwidth product of 7 MHz. With the proposed techniques, the gain-bandwidth product is increased by a factor of six. The measurable current range is between 60mA and 1.5 A. The performance is demonstrated in a 500 kHz buck converter at an input voltage of 40V. The overall circuit concept is suitable for 100V and beyond, enabling high performance power management designs including switched mode power supplies and motor applications.
The efficiency impact of air-cored inductors used close to and beyond its cut-off frequency in multi-MHz converters is investigated. A method is presented to determine the converter switching frequency that causes the lowest losses in a given inductor. Influential parameters are analysed to optimize an inductor for a predefined switching frequency.