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Employing diffuse reflection ultraviolet visible (UV–Vis) spectroscopy we developed an approach that is capable to quantitatively determine flux residues on a technical copper surface. The technical copper surface was soldered with a no-clean flux system of organic acids. By a post-solder cleaning step with different cleaning parameters, various levels of residues were produced. The surface was quantitatively and qualitatively characterized using X-ray photoelectron spectroscopy (XPS), Auger electron spectroscopy (AES), Fourier transform infrared spectroscopy (FTIR) and diffuse reflection UV–Vis spectroscopy. With the use of a multivariate analysis (MVA) we examined the UV–Vis data to create a correlation to the carbon content on the surface. The UV–Vis data could be discriminated for all groups by their level of organic residues. Combined with XPS the data were evaluated by a partial least squares (PLS) regression to establish a model. Based on this predictive model, the carbon content was calculated with an absolute error of 2.7 at.%. Due to the high correlation of predictive model, the easy-to-use measurement and the evaluation by multivariate analysis the developed method seems suitable for an online monitoring system. With this system, flux residues can be detected in a manufacturing cleaning process of technical surfaces after soldering.
The detection and characterisation of oxide layers on metallic copper samples plays an important role for power electronic modules in the automotive industry. However, since precise identification of oxide layers by visual inspection is difficult and time consuming due to inhomogeneous colour distribution, a reliable and efficient method for estimating their thickness is needed. In this study, hyperspectral imaging in the visible wavelength range (425–725 nm) is proposed as an in-line inspection method for analysing oxide layers in real-time during processing of copper components such as printed circuit boards in the automotive industry. For implementation in the production line a partial least square regression (PLSR) model was developed with a calibration set of n = 12 with about 13,000 spectra per sample to determine the oxide layer thickness on top of the technical copper surfaces. The model shows a good prediction performance in the range of 0–30 nm compared to Auger electron spectroscopy depth profiles as a reference method. The root mean square error (RMSE) is 1.75 nm for calibration and 2.70 nm for full cross validation. Applied to an external dataset of four new samples with about 13,000 spectra per sample the model provides an RMSE of 1.84 nm for prediction and demonstrates the robustness of the model during real-time processing. The results of this study prove the ability and usefulness of the proposed method to estimate the thickness of oxide layers on technical copper. Hence, the application of hyperspectral imaging for the industrial process control of electronic devices is very promising.
We report an investigation into the distribution of copper oxidation states in oxide films formed on the surfaces of technical copper. The oxide films were grown by thermal annealing at ambient conditions and studied using Auger depth profiling and UV–Vis spectroscopy. Both Auger and UV–Vis data were evaluated applying multivariate curve resolution (MCR). Both experimental techniques revealed that the growth of Cu2O dominates the initial ca. 40 nm of oxide films grown at 175 °C, while further oxide growth is dominated by CuO formation. The largely coincident results from both experimental approaches demonstrates the huge benefit of the application of UV–Vis spectroscopy in combination with MCR analysis, which provides access to information on chemical state distributions without the need for destructive sample analysis. Both approaches are discussed in detail.
An ultraviolet visible (UV–Vis) spectroscopy method was developed that can quantitatively characterize a technical copper surface to determine oxide layers and organic impurities. The oxide layers were produced by a heating step at 175 ℃ for four different times (range = 1–10 min). Partial least squares (PLS) regression was used to establish a relation between the UV–Vis spectra and film thickness measurements using Auger electron spectroscopy depth profiles. The validation accuracy of the regression is in the range of approximately 2.3 nm. The prediction model allowed obtaining an estimation of the oxide layer thickness with an absolute error of 2.9 nm. Alternatively, already known methods cannot be used because of the high roughness of the technical copper surfaces. An integrating sphere is used to measure the diffuse reflectance of these surfaces, providing an average over all angles of illumination and observation.