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Advanced power semiconductors such as DMOS transistors are key components of modern power electronic systems. Recent discrete and integrated DMOS technologies have very low area-specific on-state resistances so that devices with small sizes can be chosen. However, their power dissipation can sometimes be large, for example in fault conditions, causing the device temperature to rise significantly. This can lead to excessive temperatures, reduced lifetime, and possibly even thermal runaway and subsequent destruction. Therefore, it is required to ensure already in the design phase that the temperature always remains in an acceptable range. This paper will show how self-heating in DMOS transistors can be experimentally determined with high accuracy. Further, it will be discussed how numerical electrothermal simulations can be carried out efficiently, allowing the accurate assessment of self-heating within a few minutes. The presented approach has been successfully verified experimentally for device temperatures exceeding 500 ◦C up to the onset of thermal runaway.
DMOS transistors are often subject to high power dissipation and thus substantial self-heating. This limits their safe operating area because very high device temperatures can lead to thermal runaway and subsequent destruction. Because the peak temperature usually occurs only in a small region in the device, it is possible to redistribute part of the dissipated power from the hot region to the cooler device areas. In this way, the peak temperature is reduced, whereas the total power dissipation is still the same. Assuming that a certain temperature must not be exceeded for safe operation, the improved device is now capable of withstanding higher amounts of energy with an unchanged device area. This paper presents two simple methods to redistribute the power dissipation density and thus lower the peak device temperature. The presented methods only require layout changes. They can easily be applied to modern power technologies without the need of process modifications. Both methods are implemented in test structures and investigated by simulations and measurements.
DMOS transistors in integrated power technologies are often subject to significant self-heating and thus high temperatures, which can lead to device failure and reduced lifetime. Hence, it must be ensured that the device temperature does not rise too much. For this, the influence of the on-chip metallization must be taken into account because of the good thermal conductivity and significant thermal capacitance of the metal layers on top of the active DMOS area. In this paper, test structures with different metal layers and vias configurations are presented that can be used to determine the influence of the onchip metallization on the temperature caused by self-heating. It will be shown how accurate results can be obtained to determine even the influence of small changes in the metallization. The measurement results are discussed and explained, showing how on-chip metallization helps to lower the device temperature. This is further supported by numerical simulations. The obtained insights are valuable for technology optimization, but are also useful for calibration of temperature simulators.
In this work, a brushless, harmonic-excited wound-rotor synchronous machine is investigated which utilizes special stator and rotor windings. The windings magnetically decouple the fundamental torque-producing field from the harmonic field required for the inductive power transfer to the field coil. In contrast to conventional harmonic-excited synchronous machines, the whole winding is utilized for both torque production and harmonic excitation such that no additional copper for auxiliary windings is needed. Different rotor topologies using rotating power electronic components are investigated and their efficiencies have been compared based on Finite-Element calculation and circuit analysis.
We present a compact battery charger topology for weight and cost sensitive applications with an average output current of 9A targeted for 36V batteries commonly found in electric bicycles. Instead of using a conventional boost converter with large DC-link capacitors, we accomplish PFC-functionality by shaping the charging current into a sin²-shape. In addition, a novel control scheme without input-current sensing is introduced. A-priori knowledge is used to implement a feed-forward control in combination with a closed-loop output current control to maintain the target current. The use of a full-bridge/half bridge LLC converter enables operation in a wide input-voltage range.
A fully featured prototype has been built with a peak output power of 1050W. An average output power of 400W was measured, resulting in a power density of 1.8 kW/dm³. At 9A charging current, a power factor of 0.96 was measured and the efficiency exceeds 93% on average with passive rectification.
The impact of pulse charging has been evaluated on a 400Wh battery which was charged with the proposed converter as well as CC-CV-charging for reference. Both charging schemes show similar battery surface temperatures.
The Dual Active Bridge (DAB) is a very promising topology for future power converters. However, careless operation can lead to a DC component in the transformer current. The problem is further exacerbated when the phase shift changes during operation. This work presents a study of DC bias effects on the DAB with special regard to transient effects introduced by sudden shifts in the output load. We present a simple yet effective approach to avoid DC bias entirely.
A novel brushless excitation concept for synchronous machines with a rotating power converter is proposed in this paper. The concept does not need an auxiliary winding or any other modification to the machine structure apart from an inverter with a DC link capacitor and a controller on the rotor. The power required for the rotor excitation is provided by injecting harmonics into the stator winding. Thus, a voltage in the field coil is induced. The rotor inverter is controlled such that the alternating current charges the DC link capacitor. At the same time the inverter supplies the DC field current to the field coil. The excitation concept is first developed in theory, then presented using an analytical model and FEA, and lastly investigated with a prelimininary experimental setup.
In this work design rules for a novel brushless excitation system for externally excited synchronous machines are discussed. The concept replaces slip rings with a fullbridge active rectifier and a controller mounted on the rotor. An AC signal induced from the stator is used to charge the rotor DC link. The DC current for the rotor excitation is provided from this DC link source. Finite element analysis of an existing machine is used to analyze the practicability of the excitation system.
Improved inductive feed-forward for fast turn-on of power semiconductors during hard switching
(2019)
A transformer is used to increase the gate voltage during turn-on, thus reducing the necessary bias voltage of the gate driver. Counteracting the voltage dependency of the gate capacitance of high-voltage power devices, faster transitions are possible. The additional transformer only slighly increases the over-voltage during turn-off.
Novel design for a coreless printed circuit board transformer realizing high bandwidth and coupling
(2019)
Rogowski coils offer galvanic isolation and can measure alternating currents with a high bandwidth. Coreless printed circuit board (PCB) transformers have been used as an alternative to limit the additional stray inductance if a Rogowski coil can not be attached to the circuit. A new PCB transformer layout is proposed to reduce cost, decrease additional stray inductance, increase the bandwidth of current measurements and simplify the integration into existing designs.
In this work, a comparison between different brushless harmonic-excited wound-rotor synchronous machines is performed. The general idea of all topologies is the elimination of the slip rings and auxiliary windings by using the already existing stator and rotor winding for field excitation. This is achieved by injecting a harmonic airgap field with the help of power electronics. This harmonic field does not interact with the fundamental field, it just transfers the excitation power across the airgap. Alternative methods with varying number of phases, different pole-pair combinations, and winding layouts are covered and compared with a detailed Finite-Element-parameterized model. Parasitic effects due to saturation and coupling between the harmonic and main windings are considered.
In this work, a brushless, harmonic-excited wound-rotor synchronous machine without any auxiliary windings which can provide full torque at startup is investigated experimentally. The excitation power is transferred inductively by superimposing an additional harmonic field of different pole-pair number on top of the airgap field. This is achieved by feeding the parallel paths of the stator and rotor winding separately. A prototype for the harmonic-excited synchronous machine has been constructed and experimental results are presented to verify the concept. The main loss contributors are identified and the importance of considering core losses under harmonic excitation is discussed. A general analytical model for harmonic excited synchronous machines is proposed which enables a quick estimation of the iron core flux densities and the core losses generated by the additional harmonic currents.
DMOS transistors often suffer from substantial self-heating during high power dissipation, which can lead to thermal destruction if the device temperature reaches excessive values. A successfully demonstrated method to reduce the peak temperature is the redistribution of power dissipation density from the hotter to the cooler device areas by careful layout modification. However, this is very tedious and time-consuming if complex-shaped devices as often found in industrial applications are considered.
This paper presents an approach for fully automatic layout optimization which requires only a few hours processing time. The approach is applied to complex shaped test structures which are investigated by measurements and electro-thermal simulations. Results show a significantly lower peak temperature and an energy capability gain of 84 %, offering potential for a 18 % size reduction of active area.
This paper presents a measurement setup and an assembly technique suitable for characterization of power semiconductor devices under very high temperature conditions exceeding 500°C. An important application of this is the experimental investigation of wide bandgap semiconductors. Measurement results are shown for a 1200V SiC MOSFET and a 650V depletion mode GaN HEMT.
A TLP system with a very low characteristic impedance of 1.5 Ω and a selectable pulse length from 0.5 to 6 μs is presented. It covers the entire operation region of many power semiconductors up to 700 V and 400 A. Ist applicability is demonstrated by determining the Output characteristics for two Cool MOS devices up to destruction.
The experimental characterization of the thermal impedance Zth of large power MOSFETs is commonly done by measuring the junction temperature Tj in the cooling phase after the device has been heated, preferably to a high junction temperature for increased accuracy. However, turning off a large heating current (as required by modern MOSFETs with low on-state resistances) takes some time because of parasitic inductances in the measurement system. Thus, most setups do not allow the characterization of the junction temperature in the time range below several tens of μs.
In this paper, an optimized measurement setup is presented which allows accurate Tj characterization already 3 μs after turn-off of heating. With this, it becomes possible to experimentally investigate the influence of thermal capacitances close to the active region of the device. Measurement results will be presented for advanced power MOSFETs with very large heating currents up to 220 A. Three bonding variants are investigated and the observed differences will be explained.
Modern power DMOS transistors greatly benefit from the continuous advances of the technology, which yield devices with very low area-specific RDS,on figures of merit and therefore allow for significantly reduced active areas. However, in many applications, where the devices must dissipate high amounts of energy and thus are subjected to significant self-heating, the active area is not dictated by RDS,on requirements, but by the energy constraints. In this paper, a simple method of improving the energy capability and reliability of power DMOS transistors operating in pulsed conditions is proposed and experimentally verified. The method consists in redistributing the power density from the hotter to the cooler device regions, hence achieving a more homogeneous temperature distribution and a reduced peak temperature. To demonstrate the principle, a simple gate offset circuit is used to redistribute the current density to the cooler DMOS parts. No technology changes are needed for the implementation, only minor changes to the driver circuit are necessary, with a minimal impact on the additional required active area. Improvements in the energy capability from 9.2% up to 39% have been measured. Furthermore, measurements have shown that the method remains effective also if the operating conditions change significantly. The simplicity and the effectiveness of the implementation makes the proposed method suitable to be used in a wide range of applications.
Large power semiconductors are complex structures, their metallization usually containing many thousands of contacts or vias. Because of this, detailed FEM simulations of the whole device are nowadays not possible because of excessive simulation time.
This paper introduces a simulation approach which allows quick identification of critical regions with respect to lifetime by a simplified simulation. For this, the complex layers are replaced by a much simpler equivalent layer, allowing a simulation of the whole device even including its package. In a second step, precise simulations taking all details of the structure into account are carried out, but only for the critical regions of interest. Thus, this approach gives detailed results where required with consideration of the whole structure including packaging. Further, the simulation time requirements are very moderate.
DMOS transistors in integrated smart power technologies are often subject to cyclic power dissipation with substantial selfheating. This leads to repetitive thermo mechanical stress, causing fatigue of the on-chip metallization and limiting the lifetime. Hence, most designs use large devices for lower peak temperatures and thus reduced stress to avoid premature failures.
However, significantly smaller DMOS transistors are acceptable if the system reverts to a safer operating condition with lower stress when a failure is expected to occur in the near future. Hence, suitable early-warning sensors are required. This paper proposes a floating metal meander embedded between DMOS source and drain to detect an impending metallization failure. Measurement results of several variants will be presented and discussed, investigating their suitability as early warning indicators.
An experimental study of a zero voltage switching SiC boost converter with an active snubber network
(2015)
This paper presents a quasi-resonant, zero voltage switching (ZVS) SiC boost converter for an output power of up to 10 kW. The converter is realized with an easily controllable active snubber network that allows a reduction of switching losses by minimizing the voltage stress applied to the active switch. With this approach, an increase of the switching frequency is possible, allowing a reduction of the system size. Experiments show a maximum converter efficiency up to 99.2% for a switching frequency of 100 kHz. A second version of the converter enables a further size reduction by increasing the switching frequency to 300 kHz while still reaching a high efficiency up to 98.4 %.