Refine
Document Type
- Conference proceeding (41)
- Patent / Standard / Guidelines (11)
- Journal article (9)
- Book chapter (1)
Is part of the Bibliography
- yes (62)
Institute
- Technik (62)
Publisher
For area reasons, NMOS transistors are preferred over PMOS for the pull-up path in gate drivers. Bootstrapping has to ensure sufficient NMOS gate overdrive. Especially in high-current gate drivers with large transistors, the bootstrap capacitor is too large for integration. This paper proposes three options of fully integrated bootstrap circuits. The key idea is that the main bootstrap capacitor is supported by a second bootstrap capacitor, which is charged to a higher voltage and ensures high charge allocation when the driver turns on. A capacitor sizing guideline and the overall driver implementation including a suitable charge pump for permanent driver activation is provided. A linear regulator is used for bootstrap supply and it also compensates the voltage drop of the bootstrap diode. Measurements from a testchip in 180 nm high-voltage BiCMOS confirm the benefit of high-voltage charge storing. The fully integrated bootstrap circuit with two stacked 75.8 pF and 18.9 pF capacitors results in an expected voltage dip of lower than 1 V. Both bootstrap capacitors require 70% less area compared to a conventional bootstrap circuit. Besides drivers, the proposed bootstrap can also be directly applied to power stages to achieve fully integrated switched mode power supplies or class-D output stages.
A millimeter-wave power amplifier concept in an advanced silicon germanium (SiGe) BiCMOS technology is presented. The goal of the concept is to investigate the impact of physical limitations of the used heterojunction bipolar transistors (HBT) on the performance of a 77 GHz power amplifier. High current behavior, collectorbase breakdown and transistor saturation can be forced with the presented design. The power amplifier is manufactured in an advanced SiGe BiCMOS technology at Infineon Technologies AG with a maximum transit frequency fT of around 250 GHz for npn HBT’s [1]. The simulation results of the power amplifier show a saturated output power of 16 dBm at a power added efficiency of 13%. The test chip is designed for a supply voltage of 3.3 V and requires a chip size of 1.448 x 0.930 mm².
Die Nachfrage nach kompakten Spannungsversorgungen ist in den letzten Jahren stark gestiegen. Vor allem im Bereich der mobilen Geräte wachsen die Anforderung an die Spannungsversorgung hinsichtlich Bauvolumen und Batterielaufzeit. Für die Vollintegration von DC-DC- Wandlern als „Power Supply on Chip“ ist der SC-Wandler (Switched-Capacitor-Wandler) besonders geeignet. Insbesondere für Low-Power-Anwendungen im Bereich 10 mW kann ein SC-Wandler sehr gut, ohne externe Bauelemente, integriert werden. Während es für niedrige Eingangsspannungen (bis zu 5 V) eine Vielzahl an Topologien und Konzepten gibt, wurden SC-Wandler für höhere Eingangsspannungen (> 8 V) bisher nur wenig untersucht. Dieser Beitrag untersucht die wichtigsten Grundlagen für SC-Wandler mit Schwerpunkt auf hoher und zugleich variabler Eingangsspannung im Bereich 5 - 20 V. Am Beispiel eines Multi-Ratio-Wandlers (Wandler mit mehreren Übersetzungsverhältnissen), dem rekursiven SC-Wandler (RSC- Wandler), werden die Anforderungen eines SC- Wandler für hohe Eingangsspannungen herausgearbeitet und diskutiert.
In dieser Arbeit wird eine optimierte Bandgap-Referenz zur Erzeugung einer temperaturstabilen Spannung und eines Referenzstroms vorgestellt. Für Low-Power-Anwendungen wurde die Bandgap-Referenz, basierend auf der Brokaw-Zelle, mit minimaler Stromaufnahme und optimierter Chipfläche durch Multi-Emitter-Layout der Bipolartransistoren implementiert. Zusätzliches Merkmal ist ein verbreiteter Versorgungsspannungsbereich von 2,5 bis 5,5 V. Simulationen zeigen, dass eine stabile Ausgangsspannung von 1,218 V und ein Referenzstrom von 1,997 μA realisiert wird. Im Temperaturbereich -40 °C … 50 °C sowie dem gesamten Bereich der Versorgungsspannung beträgt die Genauigkeit der Referenzspannung ± 0,04 % mit einer Gesamtstromaufnahme zwischen 3,5 und 10 μA. Es wird eine Temperaturdrift von 2,18 ppm/K erreicht. Durch das elektronische Trimmen von Widerständen wird der Offset der Ausgangsspannung, bedingt durch Herstellungstoleranzen, auf ±3,5 mV justiert. Die Referenz wird in einer 0,18 μm BiCMOS-Technologie implementiert.
Durch schnell schaltende Leistungsendstufen werden durch kapazitive Umladeströme Störungen ins Substrat und in empfindliche Schaltungselemente eingekoppelt, die dort zur Störung der Funktion führen können. In dieser Arbeit werden Substratstrukturen zur gezielten Ableitung dieser Störungen vorgestellt und ihre Wirksamkeit mit Hilfe von Device Simulation evaluiert. Ohne Ableitstrukturen kann eine Potentialanhebung des Substrats bis zu 20 V entstehen. Die Untersuchungen belegen, dass die Potentialanhebung durch p-Typ Guard-Ringe um 75 %, durch leitende Trenches um 88 % sowie durch Rückseitenmetallisierung um nahezu 100 % reduziert werden kann.
Bootstrap circuits are mainly used for supplying a gate driver circuit to provide the gate overdrive voltage for a high-side NMOS transistor. The required charge has to be provided by a bootstrap capacitor which is often too large for integration if an acceptable voltage dip at the capacitor has to be guaranteed. Three options of an area efficient bootstrap circuit for a high side driver with an output stage of two NMOS transistors are proposed. The key idea is that the main bootstrap capacitor is supported by a second bootstrap capacitor, which is charged to a higher voltage and connected when the gate driver turns on. A high voltage swing at the second capacitor leads to a high charge allocation. Both bootstrap capacitors require up to 70% less area compared to a conventional bootstrap circuit. This enables compact power management systems with fewer discrete components and smaller die size. A calculation guideline for optimum bootstrap capacitor sizing is given. The circuit was manufactured in a 180nm high-voltage BiCMOS technology as part of a high-voltage gate driver. Measurements confirm the benefit of high-voltage charge storing. The fully integrated bootstrap circuit including two stacked 75.8pF and 18.9pF capacitors results in a voltage dip lower than 1V. This matches well with the theory of the calculation guideline.
Size and cost of a switched mode power supply can be reduced by increasing the switching frequency. The maximum switching frequency and the maximum input voltage range, respectively, is limited by the minimum propagated on-time pulse, which is mainly determined by the level shifter speed. At switching frequencies above 10 MHz, a voltage conversion with an input voltage range up to 50 V and output voltages below 5 V requires an on-time of a pulse width modulated signal of less than 5 ns. This cannot be achieved with conventional level shifters. This paper presents a level shifter circuit, which controls an NMOS power FET on a high-voltage domain up to 50 V. The level shifter was implemented as part of a DCDC converter in a 180 nm BiCMOS technology. Experimental results confirm a propagation delay of 5 ns and on-time pulses of less than 3 ns. An overlapping clamping structure with low parasitic capacitances in combination with a high-speed comparator makes the level shifter also very robust against large coupling currents during high-side transitions as fast as 20 V/ns, verified by measurements. Due to the high dv/dt, capacitive coupling currents can be two orders of magnitude larger than the actual signal current. Depending on the conversion ratio, the presented level shifter enables an increase of the switching frequency for multi-MHz converters towards 100 MHz. It supports high input voltages up to 50 V and it can be applied also to other high-speed applications.
Size and cost of a switched mode power supply can be reduced by increasing the switching frequency. This leads especially at a high input voltage to a decreasing efficiency caused by switching losses. Conventional calculations are not suitable to predict the efficiency as parasitic capacitances have a significant loss contribution. This paper presents an analytical efficiency model which considers parasitic capacitances separately and calculates the power loss contribution of each capacitance to any resistive element. The proposed model is utilized for efficiency optimization of converters with switching frequencies >10MHz and input voltages up to 40V. For experimental evaluation a DCDC converter was manufactured in a 180 nm HV BiCMOS technology. The model matches a transistor level simulation and measurement results with an accuracy better than 3.5 %. The accuracy of the parasitic capacitances of the high voltage transistor determines the overall accuracy of the efficiency model. Experimental capacitor measurements can be fed into the model. Based on the model, different architectures have been studied.
The power supply is one of the major challenges for applications like internet of things IoTs and smart home. The maintenance issue of batteries and the limited power level of energy harvesting is addressed by the integrated micro power supply presented in this paper. Connected to the 120/230 Vrms mains, which is one of the most reliable energy sources and anywhere indoor available, it provides a 3.3V DC output voltage. The micro power supply consists of a fully integrated ACDC and DCDC converter with one external low voltage SMD buffer capacitor. The micro power supply is fabricated in a low cost 0.35 μm 700 V CMOS technology and covers a die size of 7.7 mm². The use of only one external low voltage SMD capacitor, results in an extremely compact form factor. The ACDC is a direct coupled, full wave rectifier with a subsequent bipolar shunt regulator, which provides an output voltage around 17 V. The DCDC stage is a fully integrated 4:1 SC DCDC converter with an input voltage as high as 17 V and a peak efficiency of 45 %. The power supply achieves an overall output power of 3 mW, resulting in a power density of 390 μW/mm². This exceeds prior art by a factor of 11.
The power supply is one of the major challenges for applications like internet of things IoTs and smart home. The maintenance issue of batteries and the limited power level of energy harvesting is addressed by the integrated micro power supply presented in this paper. Connected to the 120/230 Vrms mains, which is one of the most reliable energy sources and anywhere indoor available, it provides a 3.3V DC output voltage. The micro power supply consists of a fully integrated ACDC and DCDC converter with one external low voltage SMD buffer capacitor. The micro power supply is fabricated in a low cost 0.35 μm 700 V CMOS technology and covers a die size of 7.7 mm². The use of only one external low voltage SMD capacitor, results in an extremely compact form factor. The ACDC is a direct coupled, full wave rectifier with a subsequent bipolar shunt regulator, which provides an output voltage around 17 V. The DCDC stage is a fully integrated 4:1 SC DCDC converter with an input voltage as high as 17 V and a peak efficiency of 45 %. The power supply achieves an overall output power of 3 mW, resulting in a power density of 390 μW/mm². This exceeds prior art by a factor of 11.
A highly integrated synchronous buck converter with a predictive dead time control for input voltages >18 V with 10 MHz switching frequency is presented. A high resolution dead time of ˜125 ps allows to reduce dead time dependent losses without requiring body diode conduction to evaluate the dead time. High resolution is achieved by frequency compensated sampling of the switching node and by an 8 bit differential delay chain. Dead time parameters are derived in a comprehensive study of dead time depended losses. This way, the efficiency of fast switching DC-DC converters can be optimized by eliminating the body diode forward conduction losses, minimizing reverse recovery losses and by achieving zero voltage switching. High-speed circuit blocks for fast switching operation are presented including level shifter, gate driver, PWM generator. The converter has been implemented in a 180 nm high-voltage BiCMOS technology.
This article covers the design of highly integrated gate drivers and level shifters for high-speed, high power efficiency and dv/dt robustness with focus on automotive applications. With the introduction of the 48 V board net in addition to the conventional 12 V battery, there is an increasing need for fast switching integrated gate drivers in the voltage range of 50 V and above. State-of-the-art drivers are able to switch 50 V in less than 5 ns. The high-voltage electrical drive train demands for galvanic isolated and highly integrated gate drivers. A gate driver with bidirectional signal transmission with a 1 MBit/s amplitude modulation, 10/20 MHz frequency modulation and power transfer over one single transformer will be discussed. The concept of high-voltage charge storing enables an area-efficient fully integrated bootstrapping supply with 70 % less area consumption. EMC is a major concern in automotive. Gate drivers with slope control optimize EMC while maintaining good switching efficiency. A current mode gate driver, which can change its drive current within 10 ns, results in 20 dBuV lower emissions between 7 and 60 MHz and 52 % lower switching loss compared to a conventional constant current gate driver.
In recent years, significant progress has been made on switched-capacitor DC-DC converters as they enable fully integrated on-chip power management. New converter topologies overcame the fixed input-to-output voltage limitation and achieved high efficiency at high power densities. SC converters are attractive to not only mobile handheld devices with small input and output voltages, but also for power conversion in IoE, industrial and automotive applications, etc. Such applications need to be capable of handling widely varying input voltages of more than 10V, which requires a large amount of conversion ratios. The goal is to achieve a fine granularity with the least number of flying capacitors. In [1] an SC converter was introduced that achieves these goals at low input voltage VIN ≤ 2.5V. [2] shows good efficiency up to VIN = 8V while its conversion ratio is restricted to ≤1/2 with a limited, non-equidistant number of conversion steps. A particular challenge arises with increasing input voltage as several loss mechanisms like parasitic bottom-plate losses and gate-charge losses of high-voltage transistors become of significant influence. High input voltages require supporting circuits like level shifters, auxiliary supply rails etc., which allocate additional area and add losses [2-5]. The combination of both increasing voltage and conversion ratios (VCR) lowers the efficiency and the achievable output power of SC converters. [3] and [5] use external capacitors to enable higher output power, especially for higher VIN. However, this is contradictory to the goal of a fully integrated power supply.
An integrated synchronous buck converter with a high resolution dead time control for input voltages up to 48V and 10MHz switching frequency is presented. The benefit of an enhanced dead time control at light loads to enable zero voltage switching at both the high-side and low-side switch at low output load is studied. This way, compact multi-MHz DCDC converters can be implemented at high efficiency over a wide load current range. The concept also eliminates body diode forward conduction losses and minimizes reverse recovery losses. A dead time resolution of 125 ps is realized by an 8-bit differential delay chain. A further efficiency enhancement by soft switching at the high-side switch at light load is achieved with a voltage boost of the switching node by dead time control in forced continuous conduction mode. The monolithic converter is implemented in an 180nm high-voltage BiCMOS technology. At V IN = 48V, V OUT = 5V, 50mA load, 10MHz switching frequency and 500 nH output inductance, the efficiency is measured to be increased by 14.4% compared to a conventional predictive dead time control. A peak efficiency of 80.9% is achieved at 12V input.
Size and cost of a boost converter can be minimized by reducing the voltage overshoot and fastening the transient response in case of load transient. The presented technique improves the transient response of a current mode controlled boost converter, which usually suffers from bandwidth limitation because of its right-half-plane zero (RHPZ). The proposed technique comprises a load current estimation which works as part of a digital controller without any additional measurements. Based on the latest load estimation the controller parameters are adapted, achieving small voltage overshoot and fast transient response. The presented technique was implemented in a digital control circuit, consisting of an ASIC in a 110 nm-technology, a Xilinx Spartan-6 field programmable gate array (FPGA), and a TI-ADS8422 analog to-digital-converter (ADC). Simulation and measurements of a 4V-to-6.3V, 500mA boost converter show an improvement of 50% in voltage overshoot and response time to load transient.
The efficiency impact of air-cored inductors used close to and beyond its cut-off frequency in multi-MHz converters is investigated. A method is presented to determine the converter switching frequency that causes the lowest losses in a given inductor. Influential parameters are analysed to optimize an inductor for a predefined switching frequency.
Switched-mode power supplies (SMPS) convert an input DC-voltage into a higher or lower output voltage. In automotive, analog control is mostly used in order to keep the required output voltages constant and resistant to disturbances. The design of robust analog control for SMPS faces parameter variations of integrated and external passive components. Using digital control, parameter variations can be eliminated and the required area for the integrated circuit can be reduced at the same time.
Digital control design bears challenges like the prevention of limit cycle oscillations and controller wind-up. This paper reviews how to prevent these effects. Digital control loops introduce new sources for dead times in the control loop, for example the latency of the analog-to-digitalconverter (ADC). Dead times have negative influence on the stability of the control loop, because they lead to phase delays. Consequently, low latency is one of the key requirements for analog-to-digital converters in digitally controlled SMPS.
Exploiting the example of a 500 kHz-buck converter with a crossover frequency of 70 kHz, this paper shows that the 5 μs-latency of a 16-analog-to-digital-converter leads to a reduction in phase margin of 126°. The latency is less critical for boost converters because of their inherent lower crossover frequencies.
Finally, the paper shows a comparison between analog and digital control of SMPS with regard to chip area and test costs.
The increasing slew rate of modern power switches can increase the efficiency and reduce the size of power electronic applications. This requires a fast and robust signal transmission to the gate driver of the high-side switch. This work proposes a galvanically isolated capacitive signal transmission circuit to increase common mode transient immunity (CMTI). An additional signal path is introduced to significantly improve the transmission robustness for small duty cycles to assure a safe turn-off of the power switch. To limit the input voltage range at the comparator on the secondary side during fast high-side transitions, a clamping structure is implemented. A comparison between a conventional and the proposed signal transmission is performed using transistor level simulations. A propagation delay of about 2 ns over a wide range of voltage transients of up to 300V/ns at input voltages up to 600V is achieved.
This paper presents an integrated synchronous buck converter for input voltages >12V with 10MHz switching frequency. The converter comprises a predictive dead time control with frequency compensated sampling of the switching node which does not require body diode forward conduction. A high dead time resolution of 125 ps is achieved by a differential delay chain with 8-bit resolution. This way, the efficiency of fast switching DCDC converters can be optimized by eliminating the body diode forward conduction losses, minimizing reverse recovery losses and by achieving zero voltage switching at turn off. The converter was implemented in a 180nm high-voltage BiCMOS technology. The power losses were measured to be reduced by 30%by the proposed dead time control, which results in a 6% efficiency increase at VOUT = 5V and 0.2A load. The peak efficiency is 81 %.