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In a digitally controlled slope shaping system, reliable detection of both voltage and current slope is required to enable a closed-loop control for various power switches independent of system parameters. In most state-of-the-art works, this is realized by monitoring the absolute voltage and current values. Better accuracy at lower DC power loss is achieved by sensing techniques for a reliable passive detection, which is achieved through avoiding DC paths from the high voltage network into the sensing network. Using a high-speed analog-to-digital converter, the whole waveform of the transient derivative can be stored digitally and prepared for a predictive cycle-by-cycle regulation, without requiring high-precision digital differentiation algorithms. To gain an accurate representation of the voltage and current derivative waveforms, system parasitics are investigated and classified in three sections: (1) component parasitics, which are identified by s-parameter measurements and extraction of equivalent circuit models, (2) PCB design issues related to the sensing circuit, and (3) interconnections between adjacent boards.
The contribution of this paper is an optimized sensing network on the basis of the experimental study supporting fast transition slopes up to 100 V/ns and 1 A/ns and beyond, making the sensing technique attractive for slope shaping of fast switching devices like modern generation IGBTs, CoolMOSTM and SiC mosfets. Measurements of the optimized dv/dt and di/dt setups are demonstrated for a hard switched IGBT power stage.
Die Nachfrage nach kompakten Spannungsversorgungen ist in den letzten Jahren stark gestiegen. Vor allem im Bereich der mobilen Geräte wachsen die Anforderung an die Spannungsversorgung hinsichtlich Bauvolumen und Batterielaufzeit. Für die Vollintegration von DC-DC- Wandlern als „Power Supply on Chip“ ist der SC-Wandler (Switched-Capacitor-Wandler) besonders geeignet. Insbesondere für Low-Power-Anwendungen im Bereich 10 mW kann ein SC-Wandler sehr gut, ohne externe Bauelemente, integriert werden. Während es für niedrige Eingangsspannungen (bis zu 5 V) eine Vielzahl an Topologien und Konzepten gibt, wurden SC-Wandler für höhere Eingangsspannungen (> 8 V) bisher nur wenig untersucht. Dieser Beitrag untersucht die wichtigsten Grundlagen für SC-Wandler mit Schwerpunkt auf hoher und zugleich variabler Eingangsspannung im Bereich 5 - 20 V. Am Beispiel eines Multi-Ratio-Wandlers (Wandler mit mehreren Übersetzungsverhältnissen), dem rekursiven SC-Wandler (RSC- Wandler), werden die Anforderungen eines SC- Wandler für hohe Eingangsspannungen herausgearbeitet und diskutiert.
Galvanic isolated gate drivers require a control signal as well as energy transmission from the control side (lowside) to the driver side (high-side). An additional backward signal transmission is preferred for error signals, status information, etc. This is often realized by means of several transformers or opto-couplers. Decreasing the number of isolation elements results in lower cost and a higher degree of miniaturization. This work presents a gate driver with bidirectional signal transmission and energy transfer via one single transformer. The key concept proposed in this paper is to combine bootstrapping to deliver the main gate charge for the driven power switch with additional energy transfer via the signal transformer. This paper also presents a very efficient combination of energy transfer to two high-side supply rails with back channel amplitude modulation. This way an isolated gate driver can be implemented that allows 100% pulse-width modulation (PWM) duty cycle at low complexity and system cost. The proposed high-side driver IC with integrated power supply, modulation and demodulation circuits was manufactured in a 180nm high-voltage BiCMOS technology. Measurements confirm the concept of bidirectional signal transmission with a 1MBit/s amplitude modulation, 10/20MHz frequency modulation and a maximum power transmission of 14mW via the transformer.
This paper presents a fully integrated gate driver in a 180-nm bipolar CMOS DMOS (BCD) technology with 1.5-A max. gate current, suitable for normally OFF gallium nitride (GaN) power switches, including gate-injection transistors (GIT). Full-bridge driver architecture provides a bipolar and three-level gate drive voltage for a robust and efficient GaN switching. The concept of high voltage energy storing (HVES), which comprises an on-chip resonant LC tank, enables a very area-efficient buffer capacitor integration and superior gatedriving speed. It reduces the component count and the influence of parasitic gate-loop inductance. Theory and calculations confirm the benefits of HVES compared to other capacitor implementation methods. The proposed gate driver delivers a gate charge of up to 11.6 nC, sufficient to drive most types of currently available GaN power transistors. Consequently, HVES enables to utilize the fast switching capabilities of GaN for advanced and compact power electronics.
Es wird ein hochintegrierter Gatetreiber für 600V-Anwendungen mit einer galvanischen Isolation zwischen der Ansteuerelektronik und der Treiberseite vorgestellt. Eine Besonderheit ist die bidirektionale Signalübertragung und die Energieversorgung über einen einzigen Transformator. Die Treiberansteuersignale werden mittels 10/20 MHz Frequenzmodulation übertragen. Die Signalrückübertragung ist in Form einer 1Mbit/s Amplitudenmodulation realisiert. Die Energieübertragung über den Transformator erlaubt ein dauerhaftes Einschalten des Treibers. Der Energiebedarf während des Schaltvorgangs wird hauptsächlich durch eine Bootstrapschaltung bereitgestellt. Eine weitere Besonderheit ist die Verwendung einer flächeneffizienten Integration einer NMOS Treiberausgangsstufe. Der Gatetreiber wurde in einer 180nm Hochvolt-BiCMOS-Technologie hergestellt. Messungen bestätigen die Funktion des Treibers.
This article covers the design of highly integrated gate drivers and level shifters for high-speed, high power efficiency and dv/dt robustness with focus on automotive applications. With the introduction of the 48 V board net in addition to the conventional 12 V battery, there is an increasing need for fast switching integrated gate drivers in the voltage range of 50 V and above. State-of-the-art drivers are able to switch 50 V in less than 5 ns. The high-voltage electrical drive train demands for galvanic isolated and highly integrated gate drivers. A gate driver with bidirectional signal transmission with a 1 MBit/s amplitude modulation, 10/20 MHz frequency modulation and power transfer over one single transformer will be discussed. The concept of high-voltage charge storing enables an area-efficient fully integrated bootstrapping supply with 70 % less area consumption. EMC is a major concern in automotive. Gate drivers with slope control optimize EMC while maintaining good switching efficiency. A current mode gate driver, which can change its drive current within 10 ns, results in 20 dBuV lower emissions between 7 and 60 MHz and 52 % lower switching loss compared to a conventional constant current gate driver.
The power supply is one of the major challenges for applications like internet of things IoTs and smart home. The maintenance issue of batteries and the limited power level of energy harvesting is addressed by the integrated micro power supply presented in this paper. Connected to the 120/230 Vrms mains, which is one of the most reliable energy sources and anywhere indoor available, it provides a 3.3V DC output voltage. The micro power supply consists of a fully integrated ACDC and DCDC converter with one external low voltage SMD buffer capacitor. The micro power supply is fabricated in a low cost 0.35 μm 700 V CMOS technology and covers a die size of 7.7 mm². The use of only one external low voltage SMD capacitor, results in an extremely compact form factor. The ACDC is a direct coupled, full wave rectifier with a subsequent bipolar shunt regulator, which provides an output voltage around 17 V. The DCDC stage is a fully integrated 4:1 SC DCDC converter with an input voltage as high as 17 V and a peak efficiency of 45 %. The power supply achieves an overall output power of 3 mW, resulting in a power density of 390 μW/mm². This exceeds prior art by a factor of 11.