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Dieses Buch vermittelt die grundlegenden Kenntnisse für den Layoutentwurf digitaler und analoger Schaltungen. Neben den ingenieurwissenschaftlichen Grundlagen werden auch Werkzeugaspekte behandelt. Das Werk befähigt Ingenieure, einen Schaltplan oder eine Netzliste in eine Layoutdarstellung zur Fertigung eines integrierten Schaltkreises (IC) oder einer Leiterplatte umzusetzen. Nach einer einleitenden Übersicht zu Fertigungstechnologien, Besonderheiten der Mikroelektronik und den Aufgaben des Layoutentwurfs behandelt Kap. 2 zunächst die technologischen Grundlagen der IC-Fertigung. Darauf aufbauend werden nachfolgend alle Aspekte des Layoutentwurfs vertieft: Schnittstellen, Entwurfsregeln und Bibliotheken (Kap. 3), Entwurfsstile, -modelle und -flüsse (Kap. 4), Entwurfsschritte (Kap. 5), Besonderheiten des analogen IC-Entwurfs (Kap. 6) und schließlich Zuverlässigkeitsmaßnahmen (Kap. 7). Das Buch eignet sich als Lehrbuch in den Ingenieurwissenschaften und als Nachschlagewerk für Schaltungs- und Layoutentwickler in der Industrie.
We discuss the fabrication technologies for IC chips in this chapter. We will focus on the main process steps and especially on those aspects that are of particular importance for understanding how they affect, and in some cases drive, the layout of ICs. All our analyses in this chapter will be for silicon as the base material; the principles and understanding gained can be applied to other substrates as well. Following a brief introduction to the fundamentals of IC fabrication (Sect. 2.1) and the base material used in it, namely silicon (Sect. 2.2), we discuss the photolithography process deployed for all structuring work in Sect. 2.3. We will then present in Sect. 2.4 some theoretical opening remarks on typical phenomena encountered in IC fabrication. Knowledge of these phenomena is very useful for understanding the process steps we cover in Sects. 2.5–2.8. We examine a simple exemplar process in Sect. 2.9 and observe how a field-effect transistor (FET) – the most important device in modern integrated circuits—is created. To drive the key points home, we provide a review of each topic at the end of every section from the point of view of layout design by discussing relevant physical design aspects.
This book covers the fundamental knowledge of layout design from the ground up, addressing both physical design, as generally applied to digital circuits, and analog layout. Such knowledge provides the critical awareness and insights a layout designer must possess to convert a structural description produced during circuit design into the physical layout used for IC/PCB fabrication.
Despite 30 years of Electronic Design Automation, analog IC layouts are still handcrafted in a laborious fashion today due to the complex challenge of considering all relevant design constraints. This paper presents Self-organized Wiring and Arrangement of Responsive Modules (SWARM), a novel approach addressing the problem with a multi-agent system: autonomous layout modules interact with each other to evoke the emergence of overall compact arrangements that fit within a given layout zone. SWARM´s unique advantage over conventional optimization-based and procedural approaches is its ability to consider crucial design constraints both explicitly and implicitly. Several given examples show that by inducing a synergistic flow of self-organization, remarkable layout results can emerge from SWARM’s decentralized decision-making model.