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In this work design rules for a novel brushless excitation system for externally excited synchronous machines are discussed. The concept replaces slip rings with a fullbridge active rectifier and a controller mounted on the rotor. An AC signal induced from the stator is used to charge the rotor DC link. The DC current for the rotor excitation is provided from this DC link source. Finite element analysis of an existing machine is used to analyze the practicability of the excitation system.
Integrated power semiconductors are often used for applications with cyclic on-chip power dissipation. This leads to repetitive self-heating and thermo-mechanical stress, causing fatigue on the on-chip metallization and possibly destruction by short circuits. Because of this, an accurate simulation of the thermo-mechanical stress is needed already during the design phase to ensure that lifetime requirements are met. However, a detailed thermo mechanical simulation of the device, including the on-chip metallization is prohibitively time-consuming due to its complex structure, typically consisting of many thin metal lines with thousands of vias. This paper introduces a two-step approach as a solution for this problem. First, a simplified but fast simulation is performed to identify the device parts with the highest stress. After, precise simulations are carried out only for them. The applicability of this method is verified experimentally for LDMOS transistors with different metal configurations. The measured lifetimes and failure locations correlate well with the simulations. Moreover, a strong influence of the layout of the on-chip metallization lifetime was observed. This could also be explained with the simulation
method.
Large power semiconductors are complex structures, their metallization usually containing many thousands of contacts or vias. Because of this, detailed FEM simulations of the whole device are nowadays not possible because of excessive simulation time.
This paper introduces a simulation approach which allows quick identification of critical regions with respect to lifetime by a simplified simulation. For this, the complex layers are replaced by a much simpler equivalent layer, allowing a simulation of the whole device even including its package. In a second step, precise simulations taking all details of the structure into account are carried out, but only for the critical regions of interest. Thus, this approach gives detailed results where required with consideration of the whole structure including packaging. Further, the simulation time requirements are very moderate.
Modern power DMOS transistors greatly benefit from the continuous advances of the technology, which yield devices with very low area-specific RDS,on figures of merit and therefore allow for significantly reduced active areas. However, in many applications, where the devices must dissipate high amounts of energy and thus are subjected to significant self-heating, the active area is not dictated by RDS,on requirements, but by the energy constraints. In this paper, a simple method of improving the energy capability and reliability of power DMOS transistors operating in pulsed conditions is proposed and experimentally verified. The method consists in redistributing the power density from the hotter to the cooler device regions, hence achieving a more homogeneous temperature distribution and a reduced peak temperature. To demonstrate the principle, a simple gate offset circuit is used to redistribute the current density to the cooler DMOS parts. No technology changes are needed for the implementation, only minor changes to the driver circuit are necessary, with a minimal impact on the additional required active area. Improvements in the energy capability from 9.2% up to 39% have been measured. Furthermore, measurements have shown that the method remains effective also if the operating conditions change significantly. The simplicity and the effectiveness of the implementation makes the proposed method suitable to be used in a wide range of applications.
The superior electrical and thermal properties of silicon carbide (SiC) allow further shrinking of the active area of future power semiconductor devices. A lower boundary of the die size can be obtained from the thermal impedance required to withstand the high power dissipation during a short-circuit event. However, this implies that the power distribution is homogeneous and that no current filamentation has to be considered. Therefore, this work investigates this assumption by evaluating the stability of a SiC-MOSFET over a wide range of operation conditions by measurements up to destruction, thermal simulations, and high-temperature characterization.
In this work, a brushless, harmonic-excited wound-rotor synchronous machine without any auxiliary windings which can provide full torque at startup is investigated experimentally. The excitation power is transferred inductively by superimposing an additional harmonic field of different pole-pair number on top of the airgap field. This is achieved by feeding the parallel paths of the stator and rotor winding separately. A prototype for the harmonic-excited synchronous machine has been constructed and experimental results are presented to verify the concept. The main loss contributors are identified and the importance of considering core losses under harmonic excitation is discussed. A general analytical model for harmonic excited synchronous machines is proposed which enables a quick estimation of the iron core flux densities and the core losses generated by the additional harmonic currents.
This work investigates the electro-thermal behavior and failure mechanism of a 600V depletion-mode GaN HEMT by experimental analysis and numerical thermal simulations. For this device, the positive temperature coefficient of the draingate leakage current can lead to the formation of hot spots. This localized thermal runaway which ultimately results in a breakdown of the inherent drain-gate junction is found to be the dominant cause of failure.