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Equations for fast and exact calculation of a simple model for heat transfer from a bond wire to a cylindrical finite mold package including nonideal heat transfer from wire to mold are presented. These allow for a characterization of an arbitrary mold/bond wire combination. The real mold geometry is approximated using the mold model cylinder radius and the thermal contact conductance of the mold/bond wire interface. For changes in bond and mold material, wire length, diameter, and current transient profiles, the resulting temperature transients can then be predicted. As the method is based on numerical integration of differential equations, arbitrary pulse shapes, which are industrially relevant, can be calculated. Very high thermal contact conductance values (above 40 000 W/m2K heat transfer) have been detected in real package/bond systems. The method was validated by successful comparison with finite element method simulations and alternative calculation methods and measurements.
Optimization-based analog layout automation does not yet find evident acceptance in the industry due to the complexity of the design problem. This paper presents a Self-organized Wiring and Arrangement of Responsive Modules (SWARM), able to consider crucial design constraints both implicitly and explicitly. The flexibility of algorithmic methods and the expert knowledge captured in PCells combine into a flow of supervised module interaction. This novel approach targets the creation of constraint-compliant layout blocks which fit into a specified zone. Provoking a synergetic self-organization, even optimal layout solutions can emerge from the interaction. Various examples depict the power of that new concept and the potential for future developments.
Due to the lack of sophisticated component libraries for microelectromechanical systems (MEMS), highly optimized MEMS sensors are currently designed using a polygon driven design flow. The advantage of this design flow is its accurate mechanical simulation, but it lacks a method for analyzing the dynamic parasitic electrostatic effects arising from the electric coupling between (stationary) wiring and structures in motion. In order to close this gap, we present a method that enables the parasitics arising from in-plane, sensor-structure motion to be extracted quasi-dynamically. With the method's structural-recognition feature we can analyze and optimize dynamic parasitic electrostatic effects.
Due to the lack of sophisticated component libraries for microelectromechanical systems (MEMS), highly optimized MEMS sensors are currently designed using a polygon driven design flow. The advantage of this design flow is its accurate mechanical simulation, but it lacks a method for an efficient and accurate electrostatic analysis of parasitic effects of MEMS. In order to close this gap in the polygon-driven design flow, we present a customized electrostatic analysis flow for such MEMS devices. Our flow features a 2.5D fabrication-process simulation, which simulates the three typical MEMS fabrication steps (namely deposition of materials including topography, deep reactive-ion etching, and the release etch by vapor-phase etching) very fast and on an acceptable abstraction level. Our new 2.5D fabrication-process simulation can be combined with commercial field-solvers such as they are commonly used in the design of integrated circuits. The new process simulation enables a faster but nevertheless satisfactory analysis of the electrostatic parasitic effects, and hence simplifies the electrical optimization of MEMS.
Anders als Digital-ICs, die hochautomatisiert entworfen werden können, ist der Entwurf analoger ICs bis heute Handarbeit. Übliche auf Optimierung basierende Automatisierungsverfahren scheitern. Die Ursachen wurden jetzt in einem Forschungsprojekt untersucht, um neue Ansätze zur Entwurfsautomatisierung analoger ICs abzuleiten.
Analog integrated circuit sizing is notoriously difficult to automate due to its complexity and scale; thus, it continues to heavily rely on human expert knowledge. This work presents a machine learning-based design automation methodology comprising pre-defined building blocks such as current mirrors or differential pairs and pre-computed look-up tables for electrical characteristics of primitive devices. Modeling the behavior of primitive devices around the operating point with neural networks combines the speed of equation-based methods with the accuracy of simulation-based approaches and, thereby, brings quality of life improvements for analog circuit designers using the gm/Id method. Extending this procedural automation method for human design experts, we present a fully autonomous sizing approach. Related work shows that the convergence properties of conventional optimization approaches improve significantly when acting in the electrical domain instead of the geometrical domain. We, therefore, formulate the circuit sizing task as a sequential decision-making problem in the alternative electrical design space. Our automation approach is based entirely on reinforcement learning, whereby abstract agents learn efficient design space navigation through interaction and without expert guidance. These agents’ learning behavior and performance are evaluated on circuits of varying complexity and different technologies, showing both the feasibility and portability of the work presented here.