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Equations for fast and exact calculation of a simple model for heat transfer from a bond wire to a cylindrical finite mold package including nonideal heat transfer from wire to mold are presented. These allow for a characterization of an arbitrary mold/bond wire combination. The real mold geometry is approximated using the mold model cylinder radius and the thermal contact conductance of the mold/bond wire interface. For changes in bond and mold material, wire length, diameter, and current transient profiles, the resulting temperature transients can then be predicted. As the method is based on numerical integration of differential equations, arbitrary pulse shapes, which are industrially relevant, can be calculated. Very high thermal contact conductance values (above 40 000 W/m2K heat transfer) have been detected in real package/bond systems. The method was validated by successful comparison with finite element method simulations and alternative calculation methods and measurements.
When a bonding wire becomes too hot, it fuses and fails. The ohmic heat that is generated in the wire can be partially dissipated to a mold package. For this cooling effect the thermal contact between wire and package is an important parameter. Because this parameter can degrade over lifetime, the fusing of a bonding wire can also occur as a long-term effect. Another important factor is the thermal power generated in the vicinity of the bond pads. Nowadays, the reliability of bond wires relies on robust dimensioning based on estimations. Smaller package sizes increase the need for better predictive methods.
The Bond Calculator, a new thermo-electrical simulation tool, is able to predict the temperature profiles along bond wires of arbitrary dimensions in dependence on the applied arbitrary transient current profile, the mold surrounding the wire, and the thermal contact between wire and mold.
In this paper we closely investigated the spatial temperature profiles along different bond wires in air in order to make a first step towards the experimental verification of the simulation model. We are using infrared microscopy in order to measure the thermal radiation generated along the bond wire. This is easier to perform quantitatively in air than in the mold package, because of the non-negligible absorbance of the mold material in the infrared wavelength region.