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Hyperspectral imaging and reflectance spectroscopy in the range from 200–380 nm were used to rapidly detect and characterize copper oxidation states and their layer thicknesses on direct bonded copper in a non-destructive way. Single-point UV reflectance spectroscopy, as a well-established method, was utilized to compare the quality of the hyperspectral imaging results. For the laterally resolved measurements of the copper surfaces an UV hyperspectral imaging setup based on a pushbroom imager was used. Six different types of direct bonded copper were studied. Each type had a different oxide layer thickness and was analyzed by depth profiling using X-ray photoelectron spectroscopy. In total, 28 samples were measured to develop multivariate models to characterize and predict the oxide layer thicknesses. The principal component analysis models (PCA) enabled a general differentiation between the sample types on the first two PCs with 100.0% and 96% explained variance for UV spectroscopy and hyperspectral imaging, respectively. Partial least squares regression (PLS-R) models showed reliable performance with R2c = 0.94 and 0.94 and RMSEC = 1.64 nm and 1.76 nm, respectively. The developed in-line prototype system combined with multivariate data modeling shows high potential for further development of this technique towards real large-scale processes.
The detection and characterisation of oxide layers on metallic copper samples plays an important role for power electronic modules in the automotive industry. However, since precise identification of oxide layers by visual inspection is difficult and time consuming due to inhomogeneous colour distribution, a reliable and efficient method for estimating their thickness is needed. In this study, hyperspectral imaging in the visible wavelength range (425–725 nm) is proposed as an in-line inspection method for analysing oxide layers in real-time during processing of copper components such as printed circuit boards in the automotive industry. For implementation in the production line a partial least square regression (PLSR) model was developed with a calibration set of n = 12 with about 13,000 spectra per sample to determine the oxide layer thickness on top of the technical copper surfaces. The model shows a good prediction performance in the range of 0–30 nm compared to Auger electron spectroscopy depth profiles as a reference method. The root mean square error (RMSE) is 1.75 nm for calibration and 2.70 nm for full cross validation. Applied to an external dataset of four new samples with about 13,000 spectra per sample the model provides an RMSE of 1.84 nm for prediction and demonstrates the robustness of the model during real-time processing. The results of this study prove the ability and usefulness of the proposed method to estimate the thickness of oxide layers on technical copper. Hence, the application of hyperspectral imaging for the industrial process control of electronic devices is very promising.