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For area reasons, NMOS transistors are preferred over PMOS for the pull-up path in gate drivers. Bootstrapping has to ensure sufficient NMOS gate overdrive. Especially in high-current gate drivers with large transistors, the bootstrap capacitor is too large for integration. This paper proposes three options of fully integrated bootstrap circuits. The key idea is that the main bootstrap capacitor is supported by a second bootstrap capacitor, which is charged to a higher voltage and ensures high charge allocation when the driver turns on. A capacitor sizing guideline and the overall driver implementation including a suitable charge pump for permanent driver activation is provided. A linear regulator is used for bootstrap supply and it also compensates the voltage drop of the bootstrap diode. Measurements from a testchip in 180 nm high-voltage BiCMOS confirm the benefit of high-voltage charge storing. The fully integrated bootstrap circuit with two stacked 75.8 pF and 18.9 pF capacitors results in an expected voltage dip of lower than 1 V. Both bootstrap capacitors require 70% less area compared to a conventional bootstrap circuit. Besides drivers, the proposed bootstrap can also be directly applied to power stages to achieve fully integrated switched mode power supplies or class-D output stages.
A millimeter-wave power amplifier concept in an advanced silicon germanium (SiGe) BiCMOS technology is presented. The goal of the concept is to investigate the impact of physical limitations of the used heterojunction bipolar transistors (HBT) on the performance of a 77 GHz power amplifier. High current behavior, collectorbase breakdown and transistor saturation can be forced with the presented design. The power amplifier is manufactured in an advanced SiGe BiCMOS technology at Infineon Technologies AG with a maximum transit frequency fT of around 250 GHz for npn HBT’s [1]. The simulation results of the power amplifier show a saturated output power of 16 dBm at a power added efficiency of 13%. The test chip is designed for a supply voltage of 3.3 V and requires a chip size of 1.448 x 0.930 mm².
Bootstrap circuits are mainly used for supplying a gate driver circuit to provide the gate overdrive voltage for a high-side NMOS transistor. The required charge has to be provided by a bootstrap capacitor which is often too large for integration if an acceptable voltage dip at the capacitor has to be guaranteed. Three options of an area efficient bootstrap circuit for a high side driver with an output stage of two NMOS transistors are proposed. The key idea is that the main bootstrap capacitor is supported by a second bootstrap capacitor, which is charged to a higher voltage and connected when the gate driver turns on. A high voltage swing at the second capacitor leads to a high charge allocation. Both bootstrap capacitors require up to 70% less area compared to a conventional bootstrap circuit. This enables compact power management systems with fewer discrete components and smaller die size. A calculation guideline for optimum bootstrap capacitor sizing is given. The circuit was manufactured in a 180nm high-voltage BiCMOS technology as part of a high-voltage gate driver. Measurements confirm the benefit of high-voltage charge storing. The fully integrated bootstrap circuit including two stacked 75.8pF and 18.9pF capacitors results in a voltage dip lower than 1V. This matches well with the theory of the calculation guideline.
Size and cost of a switched mode power supply can be reduced by increasing the switching frequency. The maximum switching frequency and the maximum input voltage range, respectively, is limited by the minimum propagated on-time pulse, which is mainly determined by the level shifter speed. At switching frequencies above 10 MHz, a voltage conversion with an input voltage range up to 50 V and output voltages below 5 V requires an on-time of a pulse width modulated signal of less than 5 ns. This cannot be achieved with conventional level shifters. This paper presents a level shifter circuit, which controls an NMOS power FET on a high-voltage domain up to 50 V. The level shifter was implemented as part of a DCDC converter in a 180 nm BiCMOS technology. Experimental results confirm a propagation delay of 5 ns and on-time pulses of less than 3 ns. An overlapping clamping structure with low parasitic capacitances in combination with a high-speed comparator makes the level shifter also very robust against large coupling currents during high-side transitions as fast as 20 V/ns, verified by measurements. Due to the high dv/dt, capacitive coupling currents can be two orders of magnitude larger than the actual signal current. Depending on the conversion ratio, the presented level shifter enables an increase of the switching frequency for multi-MHz converters towards 100 MHz. It supports high input voltages up to 50 V and it can be applied also to other high-speed applications.
Size and cost of a switched mode power supply can be reduced by increasing the switching frequency. This leads especially at a high input voltage to a decreasing efficiency caused by switching losses. Conventional calculations are not suitable to predict the efficiency as parasitic capacitances have a significant loss contribution. This paper presents an analytical efficiency model which considers parasitic capacitances separately and calculates the power loss contribution of each capacitance to any resistive element. The proposed model is utilized for efficiency optimization of converters with switching frequencies >10MHz and input voltages up to 40V. For experimental evaluation a DCDC converter was manufactured in a 180 nm HV BiCMOS technology. The model matches a transistor level simulation and measurement results with an accuracy better than 3.5 %. The accuracy of the parasitic capacitances of the high voltage transistor determines the overall accuracy of the efficiency model. Experimental capacitor measurements can be fed into the model. Based on the model, different architectures have been studied.
The power supply is one of the major challenges for applications like internet of things IoTs and smart home. The maintenance issue of batteries and the limited power level of energy harvesting is addressed by the integrated micro power supply presented in this paper. Connected to the 120/230 Vrms mains, which is one of the most reliable energy sources and anywhere indoor available, it provides a 3.3V DC output voltage. The micro power supply consists of a fully integrated ACDC and DCDC converter with one external low voltage SMD buffer capacitor. The micro power supply is fabricated in a low cost 0.35 μm 700 V CMOS technology and covers a die size of 7.7 mm². The use of only one external low voltage SMD capacitor, results in an extremely compact form factor. The ACDC is a direct coupled, full wave rectifier with a subsequent bipolar shunt regulator, which provides an output voltage around 17 V. The DCDC stage is a fully integrated 4:1 SC DCDC converter with an input voltage as high as 17 V and a peak efficiency of 45 %. The power supply achieves an overall output power of 3 mW, resulting in a power density of 390 μW/mm². This exceeds prior art by a factor of 11.
The power supply is one of the major challenges for applications like internet of things IoTs and smart home. The maintenance issue of batteries and the limited power level of energy harvesting is addressed by the integrated micro power supply presented in this paper. Connected to the 120/230 Vrms mains, which is one of the most reliable energy sources and anywhere indoor available, it provides a 3.3V DC output voltage. The micro power supply consists of a fully integrated ACDC and DCDC converter with one external low voltage SMD buffer capacitor. The micro power supply is fabricated in a low cost 0.35 μm 700 V CMOS technology and covers a die size of 7.7 mm². The use of only one external low voltage SMD capacitor, results in an extremely compact form factor. The ACDC is a direct coupled, full wave rectifier with a subsequent bipolar shunt regulator, which provides an output voltage around 17 V. The DCDC stage is a fully integrated 4:1 SC DCDC converter with an input voltage as high as 17 V and a peak efficiency of 45 %. The power supply achieves an overall output power of 3 mW, resulting in a power density of 390 μW/mm². This exceeds prior art by a factor of 11.
A highly integrated synchronous buck converter with a predictive dead time control for input voltages >18 V with 10 MHz switching frequency is presented. A high resolution dead time of ˜125 ps allows to reduce dead time dependent losses without requiring body diode conduction to evaluate the dead time. High resolution is achieved by frequency compensated sampling of the switching node and by an 8 bit differential delay chain. Dead time parameters are derived in a comprehensive study of dead time depended losses. This way, the efficiency of fast switching DC-DC converters can be optimized by eliminating the body diode forward conduction losses, minimizing reverse recovery losses and by achieving zero voltage switching. High-speed circuit blocks for fast switching operation are presented including level shifter, gate driver, PWM generator. The converter has been implemented in a 180 nm high-voltage BiCMOS technology.
This article covers the design of highly integrated gate drivers and level shifters for high-speed, high power efficiency and dv/dt robustness with focus on automotive applications. With the introduction of the 48 V board net in addition to the conventional 12 V battery, there is an increasing need for fast switching integrated gate drivers in the voltage range of 50 V and above. State-of-the-art drivers are able to switch 50 V in less than 5 ns. The high-voltage electrical drive train demands for galvanic isolated and highly integrated gate drivers. A gate driver with bidirectional signal transmission with a 1 MBit/s amplitude modulation, 10/20 MHz frequency modulation and power transfer over one single transformer will be discussed. The concept of high-voltage charge storing enables an area-efficient fully integrated bootstrapping supply with 70 % less area consumption. EMC is a major concern in automotive. Gate drivers with slope control optimize EMC while maintaining good switching efficiency. A current mode gate driver, which can change its drive current within 10 ns, results in 20 dBuV lower emissions between 7 and 60 MHz and 52 % lower switching loss compared to a conventional constant current gate driver.