Open Access

The chemical synthesis of polysiloxanes from monomeric starting materials involves a series of hydrolysis, condensation and modification reactions with complex monomeric and oligomeric reaction mixtures. Real-time monitoring and precise process control of the synthesis process is of great importance to ensure reproducible intermediates and products and can readily be performed by optical spectroscopy. In chemical reactions involving rapid and simultaneous functional group transformations and complex reaction mixtures, however, the spectroscopic signals are often ambiguous due to overlapping bands, shifting peaks and changing baselines. The univariate analysis of individual absorbance signals is hence often only of limited use. In contrast, batch modelling based on the multivariate analysis of the time course of principal components (PCs) derived from the reaction spectra provides a more efficient tool for real time monitoring. In batch modelling, not only single absorbance bands are used but information over a broad range of wavelengths is extracted from the evolving spectral fingerprints and used for analysis. Thereby, process control can be based on numerous chemical and morphological changes taking place during synthesis. “Bad” (or abnormal) batches can quickly be distinguished from “normal” ones by comparing the respective reaction trajectories in real time. In this work, FTIR spectroscopy was combined with multivariate data analysis for the in-line process characterization and batch modelling of polysiloxane formation. The synthesis was conducted under different starting conditions using various reactant concentrations. The complex spectral information was evaluated using chemometrics (principal component analysis, PCA). Specific spectral features at different stages of the reaction were assigned to the corresponding reaction steps. Reaction trajectories were derived based on batch modelling using a wide range of wavelengths. Subsequently, complexity was reduced again to the most relevant absorbance signals in order to derive a concept for a low-cost process spectroscopic set-up which could be used for real-time process monitoring and reaction control.

The detection and characterisation of oxide layers on metallic copper samples plays an important role for power electronic modules in the automotive industry. However, since precise identification of oxide layers by visual inspection is difficult and time consuming due to inhomogeneous colour distribution, a reliable and efficient method for estimating their thickness is needed. In this study, hyperspectral imaging in the visible wavelength range (425–725 nm) is proposed as an in-line inspection method for analysing oxide layers in real-time during processing of copper components such as printed circuit boards in the automotive industry. For implementation in the production line a partial least square regression (PLSR) model was developed with a calibration set of n = 12 with about 13,000 spectra per sample to determine the oxide layer thickness on top of the technical copper surfaces. The model shows a good prediction performance in the range of 0–30 nm compared to Auger electron spectroscopy depth profiles as a reference method. The root mean square error (RMSE) is 1.75 nm for calibration and 2.70 nm for full cross validation. Applied to an external dataset of four new samples with about 13,000 spectra per sample the model provides an RMSE of 1.84 nm for prediction and demonstrates the robustness of the model during real-time processing. The results of this study prove the ability and usefulness of the proposed method to estimate the thickness of oxide layers on technical copper. Hence, the application of hyperspectral imaging for the industrial process control of electronic devices is very promising.

We report an investigation into the distribution of copper oxidation states in oxide films formed on the surfaces of technical copper. The oxide films were grown by thermal annealing at ambient conditions and studied using Auger depth profiling and UV–Vis spectroscopy. Both Auger and UV–Vis data were evaluated applying multivariate curve resolution (MCR). Both experimental techniques revealed that the growth of Cu2O dominates the initial ca. 40 nm of oxide films grown at 175 °C, while further oxide growth is dominated by CuO formation. The largely coincident results from both experimental approaches demonstrates the huge benefit of the application of UV–Vis spectroscopy in combination with MCR analysis, which provides access to information on chemical state distributions without the need for destructive sample analysis. Both approaches are discussed in detail.

We report on the reflectance, transmittance and fluorescence spectra (λ=200–1200nm) of four types of chicken eggshells (white, brown, light green, dark green) measured in situ without pretreatment and after ablation of 20–100 μm of the outer shell regions. The color pigment protoporphyrin IX (PPIX) is embedded in the protein phase of all four shell types as highly fluorescent monomers, in the white and light green shells additionally as non-fluorescent dimers, and in the brown and dark green shells mainly as non-fluorescent poly-aggregates. The green shell colors are formed from an approximately equimolar mixture of PPIX and biliverdin. The axial distribution of protein and color pigments were evaluated from the combined reflectances of both the outer and inner shell surfaces, as well as from the transmittances. For the data generation we used the radiative transfer model in the random walk and Kubelka-Munk approaches.

Die Erfindung betrifft eine Vorrichtung und Verfahren zur Analyse eines Materialstroms S mit einem Einlassbereich E, einem Messbereich M und einen Auslassbereich A sowie mit einer ersten Weiche W1 und einer zweiten Weiche W2 und einem Umlenkbereich U, wobei die beiden Weichen W1, W2 in einem ersten Schaltzustand Z1 einen durchgängigen ersten Materialdurchströmungsraum vom Einlassbereich E über die erste Weiche W1 durch den Messbereich M über die zweite Weiche W2 bis zum Auslassbereich A ausbilden und in einem zweiten Schaltzustand einen durchgängigen zweiten Materialdurchströmungsraum vom Einlassbereich E über die erste Weiche W1 durch den Umkenkbereich U über die zweite Weiche W2 bis zum Auslassbereich A ausbilden.