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Software and system development is complex and diverse, and a multitude of development approaches is used and combined with each other to address the manifold challenges companies face today. To study the current state of the practice and to build a sound understanding about the utility of different development approaches and their application to modern software system development, in 2016, we launched the HELENA initiative. This paper introduces the 2nd HELENA workshop and provides an overview of the current project state. In the workshop, six teams present initial findings from their regions, impulse talk are given, and further steps of the HELENA roadmap are discussed.
To date, special interest has been paid to composite scaffolds based on polymers enriched with hydroxyapatite (HA). However, the role of HA containing different trace elements such as silicate in the structure of a polymer scaffold has not yet been fully explored. Here, we report the potential use of silicate-containing hydroxyapatite (SiHA) microparticles and microparticle aggregates in the predominant range from 2.23 to 12.40 μm in combination with polycaprolactone (PCL) as a hybrid scaffold with randomly oriented and well-aligned microfibers for regeneration of bone tissue. Chemical and mechanical properties of the developed 3D scaffolds were investigated with XRD, FTIR, EDX and tensile testing. Furthermore, the internal structure and surface morphology of the scaffolds were analyzed using synchrotron X-ray μCT and SEM. Upon culturing human mesenchymal stem cells (hMSC) on PCL-SiHA scaffolds, we found that both SiHA inclusion and microfiber orientation affected cell adhesion. The best hMSCs viability was revealed at 10 day for the PCL-SiHA scaffolds with well-aligned structure (~82%). It is expected that novel hybrid scaffolds of PCL will improve tissue ingrowth in vivo due to hydrophilic SiHA microparticles in combination with randomly oriented and well-aligned PCL microfibers, which mimic the structure of extracellular matrix of bone tissue.
For a holistic assessment of the interaction between the human body and tight fitted clothing, it is necessary to consider the mechanical properties of the body. Default avatars in CAD software are usually solid and do not take this interaction into account. For this purpose, a solid avatar is converted to a deformable one by using the soft body physics implementation in the simulation program Blender. The fit of a 3D garment on both avatars are compared, which allows a first evaluation of the differences between these approaches.
The digitization of factories will be a significant issue for the 2020s. New scenarios are emerging to increase the efficiency of production lines inside the factory, based on a new generation of robots’ collaborative functions. Manufacturers are moving towards data-driven ecosystems by leveraging product lifecycle data from connected goods. Energy-efficient communication schemes, as well as scalable data analytics, will support these various data collection scenarios. With augmented reality, new remote services are emerging that facilitate the efficient sharing of knowledge in the factory. Future communication solutions should generally ensure connectivity between the various production sites spread worldwide and new players in the value chain (e.g., suppliers, logistics) transparent, real-time, and secure. Industry 4.0 brings more intelligence and flexibility to production. Resulting in more lightweight equipment and, thus, offering better ergonomics. 5G will guarantee real-time transmissions with latencies of less than 1 ms. This will provide manufacturers with new possibilities to collect data and trigger actions automatically.
More and more power electronics applications utilize GaN transistors as they enable higher switching frequencies in comparison to conventional Si devices. Faster switching shrinks down the size of passives and enables compact solutions in applications like renewable energy, electrical cars and home appliances. GaN transistors benefit from ~10× smaller gate charge QG and gate drive voltages in the range of typically 5V vs. ~15V for Si.
An integrated synchronous buck converter with a high resolution dead time control for input voltages up to 48V and 10MHz switching frequency is presented. The benefit of an enhanced dead time control at light loads to enable zero voltage switching at both the high-side and low-side switch at low output load is studied. This way, compact multi-MHz DCDC converters can be implemented at high efficiency over a wide load current range. The concept also eliminates body diode forward conduction losses and minimizes reverse recovery losses. A dead time resolution of 125 ps is realized by an 8-bit differential delay chain. A further efficiency enhancement by soft switching at the high-side switch at light load is achieved with a voltage boost of the switching node by dead time control in forced continuous conduction mode. The monolithic converter is implemented in an 180nm high-voltage BiCMOS technology. At V IN = 48V, V OUT = 5V, 50mA load, 10MHz switching frequency and 500 nH output inductance, the efficiency is measured to be increased by 14.4% compared to a conventional predictive dead time control. A peak efficiency of 80.9% is achieved at 12V input.
In recent years, significant progress has been made on switched-capacitor DC-DC converters as they enable fully integrated on-chip power management. New converter topologies overcame the fixed input-to-output voltage limitation and achieved high efficiency at high power densities. SC converters are attractive to not only mobile handheld devices with small input and output voltages, but also for power conversion in IoE, industrial and automotive applications, etc. Such applications need to be capable of handling widely varying input voltages of more than 10V, which requires a large amount of conversion ratios. The goal is to achieve a fine granularity with the least number of flying capacitors. In [1] an SC converter was introduced that achieves these goals at low input voltage VIN ≤ 2.5V. [2] shows good efficiency up to VIN = 8V while its conversion ratio is restricted to ≤1/2 with a limited, non-equidistant number of conversion steps. A particular challenge arises with increasing input voltage as several loss mechanisms like parasitic bottom-plate losses and gate-charge losses of high-voltage transistors become of significant influence. High input voltages require supporting circuits like level shifters, auxiliary supply rails etc., which allocate additional area and add losses [2-5]. The combination of both increasing voltage and conversion ratios (VCR) lowers the efficiency and the achievable output power of SC converters. [3] and [5] use external capacitors to enable higher output power, especially for higher VIN. However, this is contradictory to the goal of a fully integrated power supply.
The presented wide-Vin step-down converter introduces a parallel-resonant converter (PRC), comprising an integrated 5-bit capacitor array and a 300 nH resonant coil, placed in parallel to a conventional buck converter. Unlike conventional resonant concepts, the implemented soft-switching control eliminates input voltage dependent losses over a wide operating range. This ensures high efficiency across a wide range of Vin= 12-48V, 100-500mA load and 5V output at up to 15MHz switching frequency. The peak efficiency of the converter is 76.3 %. Thanks to the low output current ripple, the output capacitor can be as small as 50 nF, while the inductor tolerates a larger ESR, resulting in small component size. The proposed PRC architecture is also suitable for future power electronics applications using fast-switching GaN devices.
The power supply is one of the major challenges for applications like internet of things IoTs and smart home. The maintenance issue of batteries and the limited power level of energy harvesting is addressed by the integrated micro power supply presented in this paper. Connected to the 120/230 Vrms mains, which is one of the most reliable energy sources and anywhere indoor available, it provides a 3.3V DC output voltage. The micro power supply consists of a fully integrated ACDC and DCDC converter with one external low voltage SMD buffer capacitor. The micro power supply is fabricated in a low cost 0.35 μm 700 V CMOS technology and covers a die size of 7.7 mm². The use of only one external low voltage SMD capacitor, results in an extremely compact form factor. The ACDC is a direct coupled, full wave rectifier with a subsequent bipolar shunt regulator, which provides an output voltage around 17 V. The DCDC stage is a fully integrated 4:1 SC DCDC converter with an input voltage as high as 17 V and a peak efficiency of 45 %. The power supply achieves an overall output power of 3 mW, resulting in a power density of 390 μW/mm². This exceeds prior art by a factor of 11.
This paper presents an integrated synchronous buck converter for input voltages >12V with 10MHz switching frequency. The converter comprises a predictive dead time control with frequency compensated sampling of the switching node which does not require body diode forward conduction. A high dead time resolution of 125 ps is achieved by a differential delay chain with 8-bit resolution. This way, the efficiency of fast switching DCDC converters can be optimized by eliminating the body diode forward conduction losses, minimizing reverse recovery losses and by achieving zero voltage switching at turn off. The converter was implemented in a 180nm high-voltage BiCMOS technology. The power losses were measured to be reduced by 30%by the proposed dead time control, which results in a 6% efficiency increase at VOUT = 5V and 0.2A load. The peak efficiency is 81 %.