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Large power semiconductors are complex structures, their metallization usually containing many thousands of contacts or vias. Because of this, detailed FEM simulations of the whole device are nowadays not possible because of excessive simulation time.
This paper introduces a simulation approach which allows quick identification of critical regions with respect to lifetime by a simplified simulation. For this, the complex layers are replaced by a much simpler equivalent layer, allowing a simulation of the whole device even including its package. In a second step, precise simulations taking all details of the structure into account are carried out, but only for the critical regions of interest. Thus, this approach gives detailed results where required with consideration of the whole structure including packaging. Further, the simulation time requirements are very moderate.
DMOS transistors in integrated smart power technologies are often subject to cyclic power dissipation with substantial selfheating. This leads to repetitive thermo mechanical stress, causing fatigue of the on-chip metallization and limiting the lifetime. Hence, most designs use large devices for lower peak temperatures and thus reduced stress to avoid premature failures.
However, significantly smaller DMOS transistors are acceptable if the system reverts to a safer operating condition with lower stress when a failure is expected to occur in the near future. Hence, suitable early-warning sensors are required. This paper proposes a floating metal meander embedded between DMOS source and drain to detect an impending metallization failure. Measurement results of several variants will be presented and discussed, investigating their suitability as early warning indicators.
An experimental study of a zero voltage switching SiC boost converter with an active snubber network
(2015)
This paper presents a quasi-resonant, zero voltage switching (ZVS) SiC boost converter for an output power of up to 10 kW. The converter is realized with an easily controllable active snubber network that allows a reduction of switching losses by minimizing the voltage stress applied to the active switch. With this approach, an increase of the switching frequency is possible, allowing a reduction of the system size. Experiments show a maximum converter efficiency up to 99.2% for a switching frequency of 100 kHz. A second version of the converter enables a further size reduction by increasing the switching frequency to 300 kHz while still reaching a high efficiency up to 98.4 %.
DMOS transistors often suffer from substantial self-heating during high power dissipation, which can lead to thermal destruction if the device temperature reaches excessive values. A successfully demonstrated method to reduce the peak temperature is the redistribution of power dissipation density from the hotter to the cooler device areas by careful layout modification. However, this is very tedious and time-consuming if complex-shaped devices as often found in industrial applications are considered.
This paper presents an approach for fully automatic layout optimization which requires only a few hours processing time. The approach is applied to complex shaped test structures which are investigated by measurements and electro-thermal simulations. Results show a significantly lower peak temperature and an energy capability gain of 84 %, offering potential for a 18 % size reduction of active area.
This paper presents a measurement setup and an assembly technique suitable for characterization of power semiconductor devices under very high temperature conditions exceeding 500°C. An important application of this is the experimental investigation of wide bandgap semiconductors. Measurement results are shown for a 1200V SiC MOSFET and a 650V depletion mode GaN HEMT.
A TLP system with a very low characteristic impedance of 1.5 Ω and a selectable pulse length from 0.5 to 6 μs is presented. It covers the entire operation region of many power semiconductors up to 700 V and 400 A. Ist applicability is demonstrated by determining the Output characteristics for two Cool MOS devices up to destruction.
The experimental characterization of the thermal impedance Zth of large power MOSFETs is commonly done by measuring the junction temperature Tj in the cooling phase after the device has been heated, preferably to a high junction temperature for increased accuracy. However, turning off a large heating current (as required by modern MOSFETs with low on-state resistances) takes some time because of parasitic inductances in the measurement system. Thus, most setups do not allow the characterization of the junction temperature in the time range below several tens of μs.
In this paper, an optimized measurement setup is presented which allows accurate Tj characterization already 3 μs after turn-off of heating. With this, it becomes possible to experimentally investigate the influence of thermal capacitances close to the active region of the device. Measurement results will be presented for advanced power MOSFETs with very large heating currents up to 220 A. Three bonding variants are investigated and the observed differences will be explained.
This paper investigates the electrothermal stability and the predominant defect mechanism of a Schottky gate AlGaN/GaN HEMT. Calibrated 3-D electrothermal simulations are performed using a simple semiempirical dc model, which is verified against high-temperature measurements up to 440°C. To determine the thermal limits of the safe operating area, measurements up to destruction are conducted at different operating points. The predominant failure mechanism is identified to be hot-spot formation and subsequent thermal runaway, induced by large drain–gate leakage currents that occur at high temperatures. The simulation results and the high temperature measurements confirm the observed failure patterns.
This paper addresses the turn-on switching process of insulated-gate bipolar transistor (IGBT) modules with anti-parallel free-wheeling diodes (FWD) used in inductive load switching power applications. An increase in efficiency, i.e. decrease in switching losses, calls for a fast switching process of the IGBT, but this commonly implies high values of the reverse-recovery current overshoot. To overcome this undesired behaviour, a solution was proposed which achieves an independent control of the collector current slope and peak reverse recovery current by applying a gate current that is briefly turned negative during the turn-on process. The feasibility of this approach has already been shown, however, a sophisticated control method is required for applying it in applications with varying currents, temperature and device parameters. In this paper a solution based on an adaptive, iterative closed-loop ontrol is proposed. Its effectiveness is demonstrated by experimental results from a 1200 V/200A IGBT power module for different load currents and reverse-recovery current overshoots.
The superior electrical and thermal properties of silicon carbide (SiC) allow further shrinking of the active area of future power semiconductor devices. A lower boundary of the die size can be obtained from the thermal impedance required to withstand the high power dissipation during a short-circuit event. However, this implies that the power distribution is homogeneous and that no current filamentation has to be considered. Therefore, this work investigates this assumption by evaluating the stability of a SiC-MOSFET over a wide range of operation conditions by measurements up to destruction, thermal simulations, and high-temperature characterization.