621 Angewandte Physik
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Virtual prototyping of integrated mixed-signal smart sensor systems requires high-performance co-simulation of analog frontend circuitry with complex digital controller hardware and embedded real-time software. We use SystemC/TLM 2.0 in conjunction with a cycle-count accurate temporal decoupling approach (TD) to simulate digital components and firmware code execution at high speed while preserving clock-cycle accuracy and, thus, real-time behavior at time quantum boundaries. Optimal time quanta ensuring real-time capability can be calculated and set automatically during simulation if the simulation engine has access to exact timing information about upcoming inter-process communication events. These methods fail in the case of non-deterministic, asynchronous events, resulting in potentially invalid simulation results. In this paper, we propose an extension to the case of asynchronous events generated by blackbox sources from which a priori event timing information is not available, such as coupled analog simulators or hardware in the loop. Additional event processing latency or rollback effort caused by temporal decoupling is minimized by calculating optimal time quanta dynamically in a SystemC model using a linear prediction scheme. We analyze the theoretical performance of the presented predictive temporal decoupling approach (PTD) by deriving a cost model that expresses the expected simulation effort in terms of key parameters such as time quantum size and CPU time per simulation cycle. For an exemplary smart-sensor system model, we show that quasi-periodic events that trigger activities in TD processes are handled accurately after the predictor has settled.
An ultra-low power capacitance extrema and ratio detector for electrostatic energy harvesters
(2015)
The power supply is one of the major challenges for applications like internet of things IoTs and smart home. The maintenance issue of batteries and the limited power level of energy harvesting is addressed by the integrated micro power supply presented in this paper. Connected to the 120/230 Vrms mains, which is one of the most reliable energy sources and anywhere indoor available, it provides a 3.3V DC output voltage. The micro power supply consists of a fully integrated ACDC and DCDC converter with one external low voltage SMD buffer capacitor. The micro power supply is fabricated in a low cost 0.35 μm 700 V CMOS technology and covers a die size of 7.7 mm2. The use of only one external low voltage SMD capacitor, results in an extremely compact form factor. The ACDC is a direct coupled, full wave rectifier with a subsequent bipolar shunt regulator, which provides an output voltage around 17 V. The DCDC stage is a fully integrated 4:1 SC DCDC converter with an input voltage as high as 17 V and a peak efficiency of 45 %. The power supply achieves an overall output power of 3 mW, resulting in a power density of 390 μW/mm2. This exceeds prior art by a factor of 11.