620 Ingenieurwissenschaften und Maschinenbau
Refine
Document Type
- Conference proceeding (121)
- Journal article (65)
- Book (16)
- Book chapter (13)
- Patent / Standard / Guidelines (11)
- Report (3)
- Working Paper (3)
- Doctoral Thesis (2)
- Anthology (1)
Is part of the Bibliography
- yes (235)
Institute
- Technik (235) (remove)
Publisher
- IEEE (76)
- VDE Verlag (17)
- Springer (15)
- Public Verlagsgesellschaft und Anzeigenagentur (10)
- Elsevier (7)
- Arbeitsgemeinschaft Simulation (ASIM) (5)
- Mesago Messe Frankfurt GmbH (5)
- Hanser (4)
- Hochschule Ulm (4)
- Landesanstalt für Umwelt Baden-Württemberg (4)
Since November 2011 the standard DIN 4709 stipulates performance tests for Micro-CHP units in Germany. In contrast to steady state measurements of the CHP unit itself, the test according to DIN 4709 includes the thermal storage tank as well as the internal control unit, and it is based on a 24 h test cycle following a specified thermal load profile. Hence, heat losses from the storage tank are as well taken into account as transient losses of the CHP unit. In addition, the control strategy for loading and unloading the storage tank affects the test results.
The DIN 4709 test cycle has been applied at the test stand for Micro-CHP units at Reutlingen University, and results for the Micro-CHP unit WhisperGen and the EC Power units XRGI 15® and XRGI 20® are available. During the analysis a method has been developed to evaluate the results in case the test cycle does not end in a time slot between 24 and 24.5 h after the starting as demanded by DIN 4709. Since this method has been successfully applied to the test of various CHP units of different size and technology so far, it is suggested to incorporate it to DIN 4709 during the next revision of the standard.
The performance numbers obtained reveal the differences in efficiencies measured at steady-state on the one hand and following the DIN 4709 test cycle on the other hand. While the deviations in electrical efficiencies are small, thermal efficiencies according to DIN 4709 fall below steady state data by 3–6 percentage points. This is attributed to transient thermal losses and heat losses from the storage tank, which are not included in steady state and separate testing of the CHP unit, only.
Enhancing the undergraduate educational experience : development of a micro-gas turbine laboratory
(2014)
A Capstone C30 MicroTurbine has been installed, instrumented, and utilized in a junior-level laboratory course at Valparaiso University. The C30 MicroTurbine experiment enables Valparaiso University to educate students interested in power generation and turbine technology. The first goal of this experiment is for students to explore a gas turbine generator and witness the discrepancies between idealized models and real thermodynamic systems. Secondly, students measure and analyze data to determine where losses occur in a real gas turbine. The third educational goal is for students to recognize the true costs associated with natural gas use, i.e. the hidden costs of transporting the gas to the consumer. Overall, the gas turbine experiment has garnered positive feedback from students. The twenty-six students who performed the lab in Spring 2014 rated the quality and usefulness of the gas turbine experiment as 4.28 and 4.19, respectively, on a 1-5 Likert scale, where 1 is low and 5 is high.
In visual adaptive tracking, the tracker adapts to the target, background, and conditions of the image sequence. Each update introduces some error, so the tracker might drift away from the target over time. To increase the robustness against the drifting problem, we present three ideas on top of a particle filter framework: An optical-flow-based motion estimation, a learning strategy for preventing bad updates while staying adaptive, and a sliding window detector for failure detection and finding the best training examples. We experimentally evaluate the ideas using the BoBoT dataseta. The code of our tracker is available online.
DMOS transistors are often subject to high power dissipation and thus substantial self-heating. This limits their safe operating area because very high device temperatures can lead to thermal runaway and subsequent destruction. Because the peak temperature usually occurs only in a small region in the device, it is possible to redistribute part of the dissipated power from the hot region to the cooler device areas. In this way, the peak temperature is reduced, whereas the total power dissipation is still the same. Assuming that a certain temperature must not be exceeded for safe operation, the improved device is now capable of withstanding higher amounts of energy with an unchanged device area. This paper presents two simple methods to redistribute the power dissipation density and thus lower the peak device temperature. The presented methods only require layout changes. They can easily be applied to modern power technologies without the need of process modifications. Both methods are implemented in test structures and investigated by simulations and measurements.
DMOS transistors in integrated power technologies are often subject to significant self-heating and thus high temperatures, which can lead to device failure and reduced lifetime. Hence, it must be ensured that the device temperature does not rise too much. For this, the influence of the on-chip metallization must be taken into account because of the good thermal conductivity and significant thermal capacitance of the metal layers on top of the active DMOS area. In this paper, test structures with different metal layers and vias configurations are presented that can be used to determine the influence of the onchip metallization on the temperature caused by self-heating. It will be shown how accurate results can be obtained to determine even the influence of small changes in the metallization. The measurement results are discussed and explained, showing how on-chip metallization helps to lower the device temperature. This is further supported by numerical simulations. The obtained insights are valuable for technology optimization, but are also useful for calibration of temperature simulators.